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NCP1083DER2G

Onsemi

NCP1083DER2G by Onsemi

NCP1083DER2G by Onsemi is a switching regulator with a max operating temperature of 85°C and a min operating temperature of -40°C. It has a max input voltage of 57V and is commonly used in industrial applications requiring pulse width modulation control.

Median Price

$2.070

Lifecycle Status

EOL

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 726 parts In-Stock

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$2.070

100+ parts

$2.030

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$1.990

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726

$2.070

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Verical

USA . 120 parts In-Stock

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Nova Conductors

Japan . 91 parts In-Stock

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$2.123

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ComSIT Distribution GmbH

Germany . 25,134 parts In-Stock

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Chip Stock

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Vyrian

USA . 2,835 parts In-Stock

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Goldney Electronics S.L.

Spain . 838 parts In-Stock

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Digiode

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Corohmni

South Africa . 308 parts In-Stock

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$2.081

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308

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Continental Prestige Electronics

USA . 3,958 parts In-Stock

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$2.123

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$2.081

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Argo Parts USA

USA . 2,881 parts In-Stock

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$2.123

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Netroflash

USA . 1,000 parts In-Stock

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$2.123

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1,000

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Semicontronic

India . 120 parts In-Stock

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$5.500

100+ parts

$5.362

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$5.335

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120

$5.500

$5.362

$5.335

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Ampacity Inc.

Singapore . 116 parts In-Stock

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$7.500

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AZTECH Wire

Italy . 791 parts In-Stock

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$8.091

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Aztec Data Supply Inc.

USA . 4,015 parts In-Stock

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$13.166

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Microchip USA

USA . 4,129 parts In-Stock

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$13.375

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Authorized Procurement Solutions

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iodParts Technologies Inc.

India . 21,238 parts In-Stock

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SupplyDigital Components

Austria . 7,494 parts In-Stock

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Lixinc

USA . 4,257 parts In-Stock

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Perfect Parts

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Problanco Electronics

Mexico . 2,076 parts In-Stock

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Kulean Microsystems

USA . 1,155 parts In-Stock

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TANS Electronics

Latvia . 536 parts In-Stock

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Kepictronics

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Corphita

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UHIMA Technologies

Türkiye . 3 parts In-Stock

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Overview

Experience the ultimate in switching regulators and controllers with the NCP1083DER2G by Onsemi. As a leading manufacturer, Onsemi is known for its exceptional quality and reliability. This small outline, heat sink profile product offers a wide range of applications and benefits to customers. Whether you need precise current-mode control or pulse width modulation, this switching controller delivers outstanding performance. With a maximum input voltage of 57V and an industrial temperature grade, the NCP1083DER2G is designed to meet your needs in any environment. Trust Onsemi and experience the value and advantages that the NCP1083DER2G brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy body material ensures durability and resistance to potential damage, making it a reliable choice.

Surface Mount: YES

With surface mount capability, this product offers easy installation and compatibility with modern circuit designs.

No. of Functions: 1

The presence of a single function simplifies usage and reduces complexity, making this product user-friendly and efficient.

Package Shape: RECTANGULAR

The rectangular shape of this package allows for compact and space-saving designs, making it ideal for applications with limited board space.

No. of Terminals: 20

The generous number of terminals in this product provides versatility and options for connectivity, ensuring compatibility with a wide range of systems.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This product's small outline, heat sink/slug, thin profile, and shrink pitch package style makes it suitable for applications with strict size and space requirements.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product ensures reliable performance even under challenging environmental conditions.

Control Mode: CURRENT-MODE

The current-mode control mode in this product offers precise regulation and stability, making it an excellent choice for applications where accurate current control is required.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables this product to function reliably in extreme cold environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and optimal performance.

Terminal Position: DUAL

The dual terminal position offers flexibility in connecting and configuring the product, allowing it to adapt to a variety of system architectures.

Maximum Seated Height: 1.1 mm

With a maximum seated height of only 1.1 mm, this product allows for low-profile designs, enabling space-saving and compact applications.

Width (mm): 4.4 mm

The narrow width of this product (4.4 mm) facilitates easy integration into tight spaces, making it suitable for compact electronic devices.

Other IC type: SWITCHING CONTROLLER

With a switching controller IC type, this product is designed to efficiently regulate power distribution, making it an energy-efficient choice.

Maximum Time At Peak Reflow Temperature (s): 30

The product's maximum time at peak reflow temperature of 30 seconds ensures safe soldering without damaging sensitive components.

Peak Reflow Temperature °C: 260

The peak reflow temperature capability of 260°C guarantees proper soldering and reliable connections in manufacturing processes.

Length: 6.5 mm

The compact length of 6.5 mm allows for flexibility in board layout and integration into smaller electronic devices or systems.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product is built to withstand harsh conditions and provide reliable performance in demanding environments.

Maximum Switching Frequency: 500 kHz

With a high maximum switching frequency of 500 kHz, this product enables rapid and efficient power regulation, making it suitable for high-performance systems.

Terminal Form: GULL WING

The gull wing terminal form ensures secure and robust solder connections, enhancing the product's overall reliability and longevity.

Control Technique: PULSE WIDTH MODULATION

The pulse width modulation control technique employed in this product allows for precise and adjustable power regulation, making it suitable for applications with varying power demands.

Switcher Config: SINGLE

This product's single switcher configuration simplifies design and implementation, providing ease of use and reliability for various applications.

Terminal Pitch: 0.65 mm

The tight terminal pitch of 0.65 mm allows for high-density circuit designs, enabling efficient use of board space and compact overall system size.

Moisture Sensitivity Level (MSL): 2

With an MSL rating of 2, this product can withstand moderate levels of moisture exposure, contributing to its reliability and resilience.

Minimum Input Voltage: 0 V

The product's ability to operate with a minimum input voltage of 0 volts provides flexibility and compatibility with various power supply configurations.

Maximum Input Voltage: 57 V

With a high maximum input voltage of 57 volts, this product can handle a wide range of power input requirements, making it versatile and adaptable.

Technical Specifications

Switching Regulators & Controllers NCP1083DER2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

57 V

Minimum Input Voltage:

0 V

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

500 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

NCP1083DER2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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