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NCP1079BBP065G

Onsemi

NCP1079BBP065G by Onsemi

NCP1079BBP065G by Onsemi is a switching controller with a 12V nominal voltage, operating b/w -40 to 125 °C. It features a max switching frequency of 71 kHz and uses pulse width modulation control technique. Ideal for automotive applications due to its compact size and efficient buck-boost switcher configuration.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,497 parts In-Stock

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Digiode

USA . 949 parts In-Stock

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Vigor

Singapore . 500 parts In-Stock

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Microchip USA

USA . 2,761 parts In-Stock

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AZTECH Wire

Italy . 49 parts In-Stock

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Problanco Electronics

Mexico . 8,105 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

Austria . 5,768 parts In-Stock

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TANS Electronics

Latvia . 4,262 parts In-Stock

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Corphita

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Kepictronics

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UHIMA Technologies

Türkiye . 504 parts In-Stock

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Corohmni

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Overview

Experience the superior quality and reliability of Onsemi's NCP1079BBP065G switching regulators & controllers. Designed for automotive applications, this product offers efficient current-mode control and pulse width modulation techniques, ensuring optimal performance in a compact package. With a wide operating temperature range and low supply current, this switching controller provides customers with the value and benefits they need for their power management needs. Trust Onsemi for cutting-edge technology and unmatched expertise in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides good insulation and protection to the internal components of the switching regulator.

Nominal Supply Voltage (Vsup): 12 V

The nominal supply voltage of 12V makes this switching regulator suitable for applications where a stable 12V power source is required.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this switching regulator can withstand elevated temperatures in various operating environments.

Control Mode: CURRENT-MODE

The current-mode control mode allows for effective regulation of current, resulting in improved efficiency and stability of the switching regulator.

Technology: MOS

The MOS technology used in this switching regulator ensures high efficiency and fast switching speeds, making it a reliable choice for various applications.

Maximum Switching Frequency: 71 kHz

The high maximum switching frequency of 71 kHz allows for fast response times and efficient power conversion in the switching regulator.

Control Technique: PULSE WIDTH MODULATION

The pulse width modulation control technique enables accurate control of the output voltage, ensuring stable and reliable performance of the switching regulator.

Technical Specifications

Switching Regulators & Controllers NCP1079BBP065G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

JESD-30 Code:

R-PDIP-T7

Length:

9.32 mm

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP7/8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

4.45 mm

Maximum Supply Current (Isup):

15 mA

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

71 kHz

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

NCP1079BBP065G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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