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NCP1079ABP100G

Onsemi

NCP1079ABP100G by Onsemi

NCP1079ABP100G by Onsemi is a switching controller with 12V nominal voltage, 110 kHz max switching frequency, and -40 to 125 °C operating temp. Ideal for automotive applications due to its pulse width modulation control technique and buck-boost switcher configuration.

Median Price

$2.320

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 312 parts In-Stock

1+ parts

$2.320

100+ parts

$1.404

1k+ parts

$1.326

10k+ parts

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312

$2.320

$1.404

$1.326

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Mouser Electronics

USA . 71 parts In-Stock

1+ parts

$2.580

100+ parts

$1.740

1k+ parts

$1.180

10k+ parts

-

71

$2.580

$1.740

$1.180

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Rochester

USA . 420 parts In-Stock

1+ parts

-

100+ parts

$1.470

1k+ parts

$1.220

10k+ parts

$1.090

420

-

$1.470

$1.220

$1.090

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 133 parts In-Stock

1+ parts

$1.140

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133

$1.140

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Vyrian

USA . 5,262 parts In-Stock

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5,262

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Distributors (Availability)

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Corphita

USA . 638 parts In-Stock

1+ parts

$1.080

100+ parts

-

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638

$1.080

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Corohmni

South Africa . 475 parts In-Stock

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$1.200

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475

$1.200

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Vigor

Singapore . 623 parts In-Stock

1+ parts

$2.290

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623

$2.290

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Microchip USA

USA . 2,261 parts In-Stock

1+ parts

$17.615

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2,261

$17.615

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Lixinc

USA . 16,178 parts In-Stock

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16,178

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TANS Electronics

Latvia . 6,641 parts In-Stock

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Kulean Microsystems

USA . 3,554 parts In-Stock

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3,554

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QUARKTWIN TECHNOLOGY LTD

USA . 3,190 parts In-Stock

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3,190

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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SupplyDigital Components

Austria . 1,795 parts In-Stock

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1,795

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Problanco Electronics

Mexico . 484 parts In-Stock

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UHIMA Technologies

Türkiye . 428 parts In-Stock

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428

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Overview

Unleash the power of efficiency with the NCP1079ABP100G by Onsemi. As a leader in switching regulators and controllers, Onsemi brings unparalleled quality and reliability to the table. This versatile product is ideal for a wide range of applications, providing a seamless solution for your power management needs. With a focus on performance and precision, the NCP1079ABP100G offers customers exceptional value, benefits, and advantages that will elevate your projects to the next level. Experience the difference with Onsemi's cutting-edge technology and innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and placement in circuit designs, optimizing space and layout efficiency.

Nominal Supply Voltage (Vsup): 12 V

The 12V supply voltage ensures compatibility with a wide range of power sources, making the product versatile for different voltage requirements.

Control Mode: CURRENT-MODE

The current-mode control mode allows for precise regulation of the output current, ensuring efficient and stable operation of the switching regulator.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliability and performance in challenging thermal environments.

Technology: MOS

The use of MOS technology enhances efficiency and power handling capabilities, making the product suitable for demanding power management applications.

Maximum Switching Frequency: 110 kHz

The high maximum switching frequency of 110 kHz allows for fast response and regulation of output voltage, ideal for applications requiring rapid power adjustments.

Technical Specifications

Switching Regulators & Controllers NCP1079ABP100G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

JESD-30 Code:

R-PDIP-T7

Length:

9.32 mm

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP7/8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

4.45 mm

Maximum Supply Current (Isup):

15 mA

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

110 kHz

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

NCP1079ABP100G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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