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NCP1013AP065G

Onsemi

NCP1013AP065G by Onsemi

NCP1013AP065G by Onsemi is a switching regulator with 1A output current, 71kHz max frequency, and 8V nominal input voltage. It uses pulse width modulation control technique in a rectangular plastic package for various applications requiring efficient power management.

Median Price

$0.587

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 950 parts In-Stock

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Rochester

USA . 50 parts In-Stock

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$0.587

1k+ parts

$0.487

10k+ parts

$0.434

50

-

$0.587

$0.487

$0.434

Distributors (In-Stock)

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Digiode

USA . 600 parts In-Stock

1+ parts

$0.457

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600

$0.457

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Vyrian

USA . 6,846 parts In-Stock

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Flip Electronics

USA . 950 parts In-Stock

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PC Components Company LLC

USA . 35 parts In-Stock

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Bristol Electronics

USA . 35 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,369 parts In-Stock

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$0.433

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2,369

$0.433

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Corohmni

South Africa . 223 parts In-Stock

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$0.481

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AZTECH Wire

Italy . 900 parts In-Stock

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$22.040

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900

$22.040

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QUARKTWIN TECHNOLOGY LTD

USA . 22,564 parts In-Stock

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Microchip USA

USA . 7,551 parts In-Stock

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Problanco Electronics

Mexico . 7,083 parts In-Stock

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Perfect Parts

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Kepictronics

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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TANS Electronics

Latvia . 3,044 parts In-Stock

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SupplyDigital Components

Austria . 2,790 parts In-Stock

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UHIMA Technologies

Türkiye . 426 parts In-Stock

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Kulean Microsystems

USA . 164 parts In-Stock

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GreenTree Electronics

Israel . 150 parts In-Stock

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Overview

Elevate your electronic projects with the NCP1013AP065G by Onsemi, a top-of-the-line switching regulator that guarantees superior performance and reliability. Manufactured by industry leader Onsemi, this product boasts cutting-edge technology and precision engineering for optimal efficiency. Ideal for a wide range of applications in the field of switching regulators and controllers, this innovative device offers customers unparalleled value, benefits, and advantages. Experience seamless operation and unmatched quality with the NCP1013AP065G, setting new standards in power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and reliable, making the product long-lasting.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and stacking in circuit designs.

No. of Terminals: 7

Having 7 terminals provides flexibility in connecting to different components and circuits.

Package Style (Meter): IN-LINE

In-line package style is compact and space-saving, ideal for small electronic devices.

Control Mode: CURRENT-MODE

Current-mode control offers better loop stability and transient response, improving overall performance.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for versatile PCB mounting options and flexibility in layout design.

Maximum Seated Height: 4.45 mm

Low seated height enables the product to be used in compact and slim devices.

Width (mm): 7.62 mm

Compact width makes the product suitable for space-constrained applications.

Other IC type: SWITCHING REGULATOR

Switching regulator IC type offers high efficiency and low heat dissipation for energy-efficient operation.

Nominal Input Voltage: 8 V

Nominal input voltage of 8 V is suitable for a wide range of electronic devices and systems.

Maximum Time At Peak Reflow Temperature (s): 30

With a short reflow time, the product can be quickly assembled and integrated into production lines.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and reliability in harsh operating environments.

Length: 9.78 mm

The compact length makes the product suitable for small form factor designs.

Maximum Switching Frequency: 71 kHz

High switching frequency allows for precise voltage regulation and noise reduction in electronic circuits.

Maximum Output Current: 1 A

High output current capability of 1 A enables the product to power a variety of components and peripherals.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and reliable connections to the PCB, ensuring long-term functionality.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique offers efficient power conversion and voltage regulation for optimal performance.

Switcher Config: SINGLE

Single switcher configuration simplifies the design and operation of the product, reducing complexity and cost.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54 mm allows for easy and standardized PCB mounting.

Technical Specifications

Switching Regulators & Controllers NCP1013AP065G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Nominal Input Voltage:

8 V

JESD-30 Code:

R-PDIP-T7

JESD-609 Code:

e3

Length:

9.78 mm

No. of Functions:

1

No. of Terminals:

7

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP7/8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.45 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Switcher Config:

SINGLE

Maximum Switching Frequency:

71 kHz

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.62 mm

Trade Compliance

NCP1013AP065G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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