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NCP1010ST130T3

Onsemi

NCP1010ST130T3 by Onsemi

NCP1010ST130T3 by Onsemi is a switching regulator with a max output current of 0.55A and a max switching frequency of 143kHz. It operates in current-mode control technique, suitable for applications requiring efficient power conversion in compact spaces. The package style is small outline, making it ideal for surface mount designs with limited space constraints.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 9,500 parts In-Stock

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Vyrian

USA . 5,173 parts In-Stock

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Digiode

USA . 64 parts In-Stock

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AZTECH Wire

Italy . 875 parts In-Stock

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$21.400

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875

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QUARKTWIN TECHNOLOGY LTD

USA . 25,895 parts In-Stock

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Problanco Electronics

Mexico . 7,842 parts In-Stock

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SupplyDigital Components

Austria . 5,800 parts In-Stock

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TANS Electronics

Latvia . 4,591 parts In-Stock

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Corphita

USA . 1,724 parts In-Stock

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Kulean Microsystems

USA . 480 parts In-Stock

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Microchip USA

USA . 464 parts In-Stock

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Corohmni

South Africa . 387 parts In-Stock

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UHIMA Technologies

Türkiye . 51 parts In-Stock

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Overview

Discover the power and efficiency of the NCP1010ST130T3 by Onsemi, a top-tier manufacturer in the industry. As a leading product in the Switching Regulators & Controllers category, this device offers unparalleled reliability and performance for a wide range of applications. With its compact design and advanced features like current-mode control and pulse width modulation, this switching regulator provides optimal power management solutions. Trust Onsemi to deliver quality products that exceed expectations, providing value and benefits that enhance your projects. Choose the NCP1010ST130T3 for superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability, making this product suitable for various harsh environmental conditions.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and enhancing overall product design.

Package Shape: RECTANGULAR

Rectangular shape provides ease of handling and placement during installation, contributing to streamlined manufacturing processes.

No. of Terminals: 4

Having 4 terminals simplifies the connections and integration of the switching regulator, making it user-friendly and suitable for various applications.

Terminal Position: SINGLE

Single terminal position ensures straightforward installation and connection, reducing the chance of errors and improving overall efficiency.

Maximum Output Current: 0.55 A

Capable of providing a maximum output current of 0.55 A, making this switching regulator ideal for powering lower current devices and applications.

Control Technique: PULSE WIDTH MODULATION

Utilizing PWM control technique allows for precise adjustment of output voltage, improving efficiency and stability in power regulation.

Technical Specifications

Switching Regulators & Controllers NCP1010ST130T3 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Nominal Input Voltage:

8 V

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e0

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Maximum Output Current:

.55 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOT-223

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

143 kHz

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

2.3 mm

Terminal Position:

SINGLE

Width (mm):

3.5 mm

Trade Compliance

NCP1010ST130T3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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