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NCN4557MTG

Onsemi

NCN4557MTG by Onsemi

The Onsemi NCN4557MTG is a Power Management IC with 16 terminals in a square package. It operates b/w -40 to 85°C, supporting supply voltages from 1.8V to 5.5V. Ideal for industrial applications, it features 2 channels and a compact size of 3x3mm for power supply support circuits.

Median Price

$1.890

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,268 parts In-Stock

1+ parts

-

100+ parts

$1.890

1k+ parts

$1.690

10k+ parts

$1.590

6,268

-

$1.890

$1.690

$1.590

Farnell

UK . 6,268 parts In-Stock

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-

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$1.840

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6,268

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$1.840

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Verical

USA . 3,404 parts In-Stock

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$2.112

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3,404

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$2.112

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.957

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50

$1.957

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Digiode

USA . 611 parts In-Stock

1+ parts

$1.986

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611

$1.986

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Vyrian

USA . 2,859 parts In-Stock

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2,859

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A&K Electronics

USA . 53 parts In-Stock

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53

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Rotakorn

Sweden . 53 parts In-Stock

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53

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Bristol Electronics

USA . 53 parts In-Stock

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53

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Distributors (Availability)

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Ampacity Inc.

Singapore . 6,008 parts In-Stock

1+ parts

$1.560

100+ parts

-

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6,008

$1.560

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Semicontronic

India . 5,947 parts In-Stock

1+ parts

$1.560

100+ parts

$1.521

1k+ parts

$1.513

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-

5,947

$1.560

$1.521

$1.513

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Corohmni

South Africa . 132 parts In-Stock

1+ parts

$1.840

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132

$1.840

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Corphita

USA . 534 parts In-Stock

1+ parts

$1.881

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534

$1.881

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Continental Prestige Electronics

USA . 5,762 parts In-Stock

1+ parts

$1.957

100+ parts

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$1.918

5,762

$1.957

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-

$1.918

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.957

100+ parts

-

1k+ parts

$1.859

10k+ parts

$1.820

2,000

$1.957

-

$1.859

$1.820

Argo Parts USA

USA . 178 parts In-Stock

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$1.957

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178

$1.957

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Aztec Data Supply Inc.

USA . 2,835 parts In-Stock

1+ parts

$6.480

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2,835

$6.480

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AZTECH Wire

Italy . 831 parts In-Stock

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$10.260

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831

$10.260

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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TANS Electronics

Latvia . 1,627 parts In-Stock

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1,627

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SupplyDigital Components

Austria . 1,314 parts In-Stock

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1,314

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Kulean Microsystems

USA . 1,281 parts In-Stock

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1,281

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Problanco Electronics

Mexico . 363 parts In-Stock

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363

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Microchip USA

USA . 267 parts In-Stock

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UHIMA Technologies

Türkiye . 162 parts In-Stock

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Kepictronics

USA . 51 parts In-Stock

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Overview

Unlock the power of efficient energy management with the NCN4557MTG by Onsemi. Crafted with precision and expertise, this Power Management IC is designed to meet the highest quality standards, ensuring reliable performance in a wide range of applications. From industrial to consumer electronics, this versatile chip carrier boasts a very thin profile and quad terminal position for seamless integration. With a minimum supply voltage of 1.8V and maximum supply voltage of 5.5V, this product offers unparalleled value and benefits to customers seeking optimal power supply support and innovative solutions. Elevate your projects with the NCN4557MTG and experience the difference of Onsemi's cutting-edge technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, making this power management IC suitable for compact and space-constrained applications.

Package Shape: SQUARE

The square package shape provides stability and ease of handling during assembly, ensuring a secure fit within the circuit design.

No. of Terminals: 16

With 16 terminals, this power management IC offers versatility in connections and interface options, accommodating various circuit configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance under demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C guarantees functionality in a wide range of temperature settings, ideal for industrial applications.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good solderability and electrical conductivity, enhancing the reliability and longevity of the connections.

Maximum Seated Height: 0.8 mm

The low maximum seated height of 0.8mm allows for a slim profile design, suitable for applications where space-saving is critical.

Width (mm): 3 mm

The compact width of 3mm enables easy integration into tight PCB layouts, facilitating a more efficient use of board space.

Minimum Supply Voltage (Vsup): 1.8 V

The low minimum supply voltage requirement of 1.8V allows for compatibility with a wide range of power sources, offering flexibility in system design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures robust performance in harsh operating environments, making this power management IC suitable for industrial applications.

No. of Channels: 2

Having 2 channels allows for dual power supply support, providing versatility in powering multiple components or subsystems within the same circuit design.

Terminal Form: NO LEAD

The no lead terminal form minimizes the risk of short circuits and improves reliability, enhancing the overall durability of the power management IC.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this power management IC can support a wide range of voltage inputs, offering compatibility with various power sources.

Technical Specifications

Power Management ICs NCN4557MTG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

INTERNAL LDOS REQUIRES VBAT 2.7 TO 5.5 V

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3 mm

Trade Compliance

NCN4557MTG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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