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NC7WZ126L8X-L22185

Onsemi

NC7WZ126L8X-L22185 by Onsemi

The Onsemi NC7WZ126L8X-L22185 is a bus driver with 2 functions, featuring a propagation delay of 6 ns and operating temperature range of -40 to 85°C. Ideal for industrial applications requiring true output polarity control at supply voltages ranging from 1.65V to 5.5V.

Median Price

$0.195

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 5,000 parts In-Stock

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5,000

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Distributors (In-Stock)

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Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$0.187

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750

$0.187

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Flip Electronics

USA . 55,000 parts In-Stock

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55,000

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NAC Semi

USA . 10,000 parts In-Stock

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$0.203

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$0.203

Vyrian

USA . 4,368 parts In-Stock

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4,368

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Digiode

USA . 1,562 parts In-Stock

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1,562

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Distributors (Availability)

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Corohmni

South Africa . 426 parts In-Stock

1+ parts

$0.183

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426

$0.183

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Continental Prestige Electronics

USA . 5,383 parts In-Stock

1+ parts

$0.187

100+ parts

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$0.183

5,383

$0.187

-

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$0.183

Argo Parts USA

USA . 1,901 parts In-Stock

1+ parts

$0.187

100+ parts

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$0.181

1,901

$0.187

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$0.181

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.187

100+ parts

-

1k+ parts

$0.178

10k+ parts

$0.174

100

$0.187

-

$0.178

$0.174

Microchip USA

USA . 9,180 parts In-Stock

1+ parts

$1.039

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9,180

$1.039

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AZTECH Wire

Italy . 763 parts In-Stock

1+ parts

$11.310

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763

$11.310

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Ampacity Inc.

Singapore . 4,575 parts In-Stock

1+ parts

$47.000

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4,575

$47.000

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Problanco Electronics

Mexico . 8,308 parts In-Stock

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8,308

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Eastek

USA . 5,000 parts In-Stock

1+ parts

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$0.200

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5,000

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$0.200

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Kulean Microsystems

USA . 3,782 parts In-Stock

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3,782

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SupplyDigital Components

Austria . 2,704 parts In-Stock

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2,704

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Corphita

USA . 1,979 parts In-Stock

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1,979

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TANS Electronics

Latvia . 1,084 parts In-Stock

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1,084

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UHIMA Technologies

Türkiye . 984 parts In-Stock

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984

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Overview

Enhance your electronic designs with the high-quality NC7WZ126L8X-L22185 bus driver & transceiver by Onsemi. With a fast propagation delay of 6ns and 3-state output characteristics, this versatile chip carrier offers seamless integration into various applications. From industrial automation to consumer electronics, this product delivers exceptional performance and reliability. Trust Onsemi's expertise in semiconductor technology to provide you with innovative solutions that optimize your designs. Upgrade your projects with the NC7WZ126L8X-L22185 and experience enhanced functionality and efficiency like never before.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on a PCB, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape offers a compact footprint, making it ideal for applications where space is limited.

Nominal Supply Voltage: 1.8V

Low supply voltage helps in reducing power consumption, making the product energy-efficient.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance of the product in harsh environmental conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the overall performance of the product.

Technical Specifications

Bus Driver & Transceivers NC7WZ126L8X-L22185 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE HIGH

Family:

LVC/LCX/Z

JESD-30 Code:

S-XQCC-N8

JESD-609 Code:

e4

Length:

1.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC8,.06SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

1.6 mm

Trade Compliance

NC7WZ126L8X-L22185 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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