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NC7WZ04L6X-L22175

Onsemi

NC7WZ04L6X-L22175 by Onsemi

The Onsemi NC7WZ04L6X-L22175 is a CMOS Logic Gate with 2 functions, featuring a propagation delay of 8.4ns at 1.8V supply voltage. Ideal for applications requiring fast signal processing in compact designs due to its small outline and very thin profile package style.

Median Price

$0.432

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 50 parts In-Stock

1+ parts

$0.440

100+ parts

-

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50

$0.440

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Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.425

10k+ parts

-

5,000

-

-

$0.425

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 48 parts In-Stock

1+ parts

$0.147

100+ parts

-

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48

$0.147

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Digiode

USA . 1,932 parts In-Stock

1+ parts

$0.418

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1,932

$0.418

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Vyrian

USA . 3,447 parts In-Stock

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3,447

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Distributors (Availability)

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Corohmni

South Africa . 443 parts In-Stock

1+ parts

$0.141

100+ parts

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443

$0.141

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$0.144

100+ parts

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1k+ parts

$0.138

10k+ parts

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50

$0.144

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$0.138

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Ampacity Inc.

Singapore . 2,296 parts In-Stock

1+ parts

$0.361

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2,296

$0.361

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Corphita

USA . 85 parts In-Stock

1+ parts

$0.396

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85

$0.396

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Microchip USA

USA . 6,940 parts In-Stock

1+ parts

$0.828

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6,940

$0.828

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QUARKTWIN TECHNOLOGY LTD

USA . 23,111 parts In-Stock

1+ parts

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Kulean Microsystems

USA . 6,368 parts In-Stock

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6,368

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Problanco Electronics

Mexico . 6,365 parts In-Stock

1+ parts

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6,365

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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5,000

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SupplyDigital Components

Austria . 3,007 parts In-Stock

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3,007

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TANS Electronics

Latvia . 1,579 parts In-Stock

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1,579

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UHIMA Technologies

Türkiye . 989 parts In-Stock

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989

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Overview

Enhance your electronic projects with the NC7WZ04L6X-L22175 by Onsemi, a high-quality logic gate that delivers reliable performance and precision. Manufactured by Onsemi, a trusted name in the industry known for their cutting-edge technology and innovation. Ideal for a wide range of applications, this logic gate offers fast propagation delay, low power consumption, and compact design. Experience seamless integration and improved efficiency with the NC7WZ04L6X-L22175, providing unmatched value and benefits to customers seeking top-tier components for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the product durable and resistant to damage, ensuring a long lifespan.

Propagation Delay At Nominal Supply: 8.4 ns

With a fast propagation delay, this product allows for quick signal processing and efficient operation.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the circuit board.

Nominal Supply Voltage / Vsup: 1.8V

The low nominal supply voltage of 1.8V makes this product energy-efficient and suitable for power-sensitive applications.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable and reliable performance in various circuit configurations.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption and high noise immunity, making it a reliable choice for digital logic circuits.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high heat environments.

Minimum Operating Temperature: -40 °C

The product's ability to operate at temperatures as low as -40°C makes it suitable for use in a wide range of environments.

Technical Specifications

Logic Gates NC7WZ04L6X-L22175 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-N6

Length:

1.45 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay At Nominal Supply:

8.4 ns

Propagation Delay (tpd):

11 ns

Schmitt Trigger:

NO

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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