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NC7SZ86M5

Onsemi

NC7SZ86M5 by Onsemi

The Onsemi NC7SZ86M5 is a CMOS logic gate with 2 inputs, 6.5 ns propagation delay, and 1.8V nominal voltage. Ideal for industrial applications requiring fast signal processing in a small outline package with surface mount capability.

Median Price

$0.306

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 409,874 parts In-Stock

1+ parts

-

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$0.306

1k+ parts

$0.254

10k+ parts

$0.226

409,874

-

$0.306

$0.254

$0.226

DigiKey

USA . 376,500 parts In-Stock

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$0.380

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$0.380

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Verical

USA . 348,000 parts In-Stock

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$0.283

348,000

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$0.283

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Vyrian

USA . 3,153 parts In-Stock

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$0.202

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$0.202

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Digiode

USA . 1,457 parts In-Stock

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$0.237

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DigiKey Marketplace

USA . 375,250 parts In-Stock

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Chip Stock

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R&J Components

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ACDS - Activité Composants Distribution Service

France . 6,250 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3,250 parts In-Stock

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Anansix

USA . 1,799 parts In-Stock

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Prism Electronics

USA . 375 parts In-Stock

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Tectiva GmbH

Germany . 314 parts In-Stock

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PC Components Company LLC

USA . 250 parts In-Stock

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250

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Lantek

USA . 250 parts In-Stock

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250

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Bristol Electronics

USA . 250 parts In-Stock

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250

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A2Z Electronics, Inc.

USA . 244 parts In-Stock

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Cyclops Electronics Ltd

UK . 110 parts In-Stock

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Sensible Micro Corp

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Extreme Components

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Semi Source

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Mil-Aero Solutions, Inc.

USA . 10 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 198 parts In-Stock

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$0.185

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Corphita

USA . 1,325 parts In-Stock

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$0.224

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Perfect Parts

USA . 574,047 parts In-Stock

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Continental Prestige Electronics

USA . 408,622 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 254,000 parts In-Stock

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RC Electronics

USA . 54,000 parts In-Stock

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$0.120

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Metaverse IC Inc.

Canada . 38,750 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 27,941 parts In-Stock

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SupplyDigital Components

Austria . 7,840 parts In-Stock

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Microchip USA

USA . 4,944 parts In-Stock

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Problanco Electronics

Mexico . 4,437 parts In-Stock

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TANS Electronics

Latvia . 4,151 parts In-Stock

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Kepictronics

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Kulean Microsystems

USA . 2,808 parts In-Stock

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Supply Digital

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Glotronic Ltd.

UK . 400 parts In-Stock

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GreenTree Electronics

Israel . 250 parts In-Stock

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Assy Fe

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Component Stockers USA

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UHIMA Technologies

Türkiye . 5 parts In-Stock

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Overview

Experience the seamless performance and reliability of the NC7SZ86M5 by Onsemi, a leading manufacturer in the industry. This Logic Gate offers unparalleled speed with a propagation delay of just 6.5 ns, making it ideal for applications requiring quick response times. Its compact design and low power consumption ensure efficiency without compromising on quality. Perfectly suited for industrial-grade projects, this versatile component guarantees optimal functionality and precision. Elevate your designs with the NC7SZ86M5 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 6.5 ns

Low propagation delay ensures fast response times which is essential for efficient processing of signals.

Surface Mount: YES

Surface mount design allows for easy installation and space-saving on circuit boards.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low supply voltage, making it energy efficient and suitable for low power applications.

Maximum I (ol): 24 Amp

High output current capability allows for driving of heavy loads without the need for external amplification.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates reliable and efficient.

Technical Specifications

Logic Gates NC7SZ86M5 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

NC7SZ86M5 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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