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NC7SZ386P6X-L22347

Onsemi

NC7SZ386P6X-L22347 by Onsemi

The Onsemi NC7SZ386P6X-L22347 is a CMOS Logic Gate with 3 inputs, 23ns propagation delay, and 1.8V nominal voltage. Ideal for applications requiring fast signal processing in compact spaces due to its small outline package style and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,587 parts In-Stock

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Digiode

USA . 2,234 parts In-Stock

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Microchip USA

USA . 8,086 parts In-Stock

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$0.577

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AZTECH Wire

Italy . 202 parts In-Stock

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$9.490

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Component Stockers USA

USA . 697 parts In-Stock

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$99.990

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Problanco Electronics

Mexico . 7,870 parts In-Stock

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TANS Electronics

Latvia . 7,215 parts In-Stock

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SupplyDigital Components

Austria . 5,759 parts In-Stock

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Corphita

USA . 1,996 parts In-Stock

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UHIMA Technologies

Türkiye . 985 parts In-Stock

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Corohmni

South Africa . 296 parts In-Stock

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Kulean Microsystems

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Overview

Discover the NC7SZ386P6X-L22347 by Onsemi, a high-quality logic gate that offers superior performance and reliability. Manufactured by Onsemi, a trusted leader in semiconductor solutions, this product is perfect for a wide range of applications. With its compact design and low power consumption, this logic gate provides exceptional value and benefits to customers. Whether you're looking to enhance your electronic projects or streamline your circuit designs, the NC7SZ386P6X-L22347 is the perfect choice for your needs. Experience the difference with Onsemi's innovative technology and unlock endless possibilities with this versatile logic gate.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers durability and low cost, making it suitable for various applications.

Propagation Delay At Nominal Supply: 23 ns

Low propagation delay ensures fast processing speed and efficiency in signal transmission.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

No. of Inputs: 3

Having 3 inputs allows for more complex logic operations to be performed, increasing the versatility of the product.

Nominal Supply Voltage / Vsup (V): 1.8

Operates efficiently at a low supply voltage of 1.8V, suitable for low power consumption applications.

Load Capacitance (CL): 15 pF

Low load capacitance ensures minimal power consumption and efficient operation.

Maximum I (ol): 32 Amp

High output current rating of 32A allows for driving of heavy loads, increasing the product's compatibility with various devices.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and high speed operation, making the product reliable and efficient.

Technical Specifications

Logic Gates NC7SZ386P6X-L22347 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

Length:

2 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

32 Amp

No. of Functions:

1

No. of Inputs:

3

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

23 ns

Propagation Delay (tpd):

23 ns

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

NC7SZ386P6X-L22347 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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