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NC7SZ00L6X-L22175

Onsemi

NC7SZ00L6X-L22175 by Onsemi

The Onsemi NC7SZ00L6X-L22175 is a CMOS Logic Gate with 2 inputs, 10 ns propagation delay, and 1.8V nominal voltage. Ideal for industrial applications requiring fast signal processing in compact designs due to its small outline package and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Flip Electronics

USA . 90,000 parts In-Stock

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Vyrian

USA . 2,623 parts In-Stock

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2,623

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Digiode

USA . 750 parts In-Stock

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750

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Distributors (Availability)

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Microchip USA

USA . 6,245 parts In-Stock

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$0.820

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6,245

$0.820

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AZTECH Wire

Italy . 1,174 parts In-Stock

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$16.140

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1,174

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Kulean Microsystems

USA . 8,177 parts In-Stock

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8,177

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SupplyDigital Components

Austria . 5,850 parts In-Stock

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5,850

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Problanco Electronics

Mexico . 5,161 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,686 parts In-Stock

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3,686

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TANS Electronics

Latvia . 1,915 parts In-Stock

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Corphita

USA . 1,579 parts In-Stock

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UHIMA Technologies

Türkiye . 990 parts In-Stock

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990

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Corohmni

South Africa . 428 parts In-Stock

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Overview

Unlocking endless possibilities in logic gates, the Onsemi NC7SZ00L6X-L22175 is a game-changer in the industry. With a focus on quality and reliability, Onsemi has crafted a product that exceeds expectations. The applications of this category are limitless, from consumer electronics to industrial automation. Offering unparalleled value, benefits, and advantages, this product delivers high performance with minimal power consumption. Stay ahead of the curve with Onsemi's innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and resistant to external factors, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 10 ns

Low propagation delay ensures fast signal processing and high-speed operation of the logic gates.

Surface Mount: YES

Surface mount capability makes it easy to integrate the logic gates onto PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 1.8

Low nominal supply voltage allows for reduced power consumption and compatibility with lower voltage systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates efficient and reliable in operation.

Technical Specifications

Logic Gates NC7SZ00L6X-L22175 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NC7SZ00L6X-L22175 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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