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NC7SU04P5X-L22057

Onsemi

NC7SU04P5X-L22057 by Onsemi

The Onsemi NC7SU04P5X-L22057 is a CMOS Logic Gate with 35ns Propagation Delay at 3V. It has a load capacitance of 50pF and can handle up to 2.6A output current. Ideal for applications requiring fast signal processing in compact electronic devices.

Median Price

$0.048

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 9,000 parts In-Stock

1+ parts

$0.048

100+ parts

-

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9,000

$0.048

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EBV Elektronik

Germany . 9,000 parts In-Stock

1+ parts

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9,000

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Distributors (In-Stock)

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Digiode

USA . 1,326 parts In-Stock

1+ parts

$0.065

100+ parts

-

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1,326

$0.065

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.102

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50

$0.102

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Flip Electronics

USA . 123,000 parts In-Stock

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123,000

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Vyrian

USA . 3,159 parts In-Stock

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3,159

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Distributors (Availability)

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Semicontronic

India . 8,868 parts In-Stock

1+ parts

$0.058

100+ parts

$0.057

1k+ parts

$0.056

10k+ parts

-

8,868

$0.058

$0.057

$0.056

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Ampacity Inc.

Singapore . 8,747 parts In-Stock

1+ parts

$0.058

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8,747

$0.058

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Corphita

USA . 469 parts In-Stock

1+ parts

$0.061

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469

$0.061

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Corohmni

South Africa . 203 parts In-Stock

1+ parts

$0.068

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203

$0.068

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Argo Parts USA

USA . 1,551 parts In-Stock

1+ parts

$0.102

100+ parts

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10k+ parts

$0.099

1,551

$0.102

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$0.099

Continental Prestige Electronics

USA . 926 parts In-Stock

1+ parts

$0.102

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$0.100

926

$0.102

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$0.100

Microchip USA

USA . 7,005 parts In-Stock

1+ parts

$0.515

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7,005

$0.515

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AZTECH Wire

Italy . 403 parts In-Stock

1+ parts

$19.390

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403

$19.390

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Glotronic Ltd.

UK . 7,200 parts In-Stock

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7,200

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TANS Electronics

Latvia . 5,680 parts In-Stock

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5,680

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Kulean Microsystems

USA . 4,558 parts In-Stock

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4,558

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SupplyDigital Components

Austria . 3,117 parts In-Stock

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Problanco Electronics

Mexico . 1,459 parts In-Stock

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1,459

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UHIMA Technologies

Türkiye . 989 parts In-Stock

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989

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Overview

Experience unparalleled performance and reliability with the NC7SU04P5X-L22057 by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality logic gates that are ideal for a wide range of applications. Whether you're looking to enhance your circuit designs or streamline your operations, this product offers exceptional value, benefits, and advantages. With a fast propagation delay, small outline package, and dual terminal position, this logic gate is perfect for your project needs. Trust Onsemi to provide you with the cutting-edge technology you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the logic gates, ensuring a longer lifespan and reliable performance.

Propagation Delay At Nominal Supply: 35 ns

Fast propagation delay allows for quick signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Easier and more efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3

Compatible with common supply voltages, making it versatile and easy to integrate into existing systems.

Load Capacitance (CL): 50 pF

Capable of driving moderate loads, making it suitable for a wide range of applications.

No. of Terminals: 5

Provides necessary connection points for input and output signals, enabling effective communication within a circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact design saves space on the circuit board, allowing for more efficient use of available real estate.

Maximum I (ol): 2.6 Amp

Capable of driving higher current loads, making it suitable for applications that require more power.

Propagation Delay (tpd): 125 ns

Provides a balance between speed and power consumption, making it a versatile choice for various applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliable operation even in challenging environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in cold temperatures, making it suitable for a wide range of operating conditions.

Terminal Position: DUAL

Provides multiple connection points for flexibility in circuit design, accommodating different signal routing configurations.

Maximum Seated Height: 1.1 mm

Low profile design allows for space-efficient installation in compact electronic devices.

Width: 1.25 mm

Compact width enables closer placement of components on the circuit board, enhancing the overall system's efficiency.

Minimum Supply Voltage (Vsup): 2 V

Can operate at low voltages, making it suitable for battery-powered devices or applications with limited power source options.

Length: 2 mm

Small footprint saves space on the circuit board, allowing for more compact and streamlined electronic designs.

Technology: CMOS

Low power consumption and high noise immunity, making it an energy-efficient and reliable choice for logic gates.

Terminal Form: GULL WING

Facilitates easy soldering and assembly, ensuring a secure connection between the logic gates and the circuit board.

Packing Method: TR

Secure packaging for transportation and storage, protecting the product from damage and ensuring its integrity upon arrival.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for closer spacing of connections, enabling higher density integration on the circuit board.

Maximum Supply Voltage (Vsup): 6 V

Capable of operating at higher voltages, providing flexibility for a wider range of applications and power supply options.

Maximum Power Supply Current (ICC): 25 mA

Efficient power consumption and manageable current draw, making it suitable for low-power devices or applications with limited power availability.

Technical Specifications

Logic Gates NC7SU04P5X-L22057 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

2.6 Amp

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

25 mA

Propagation Delay At Nominal Supply:

35 ns

Propagation Delay (tpd):

125 ns

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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