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NC7ST32M5X-L22090

Onsemi

NC7ST32M5X-L22090 by Onsemi

The Onsemi NC7ST32M5X-L22090 is a CMOS Logic Gate with 2 inputs, 31ns propagation delay at 5V. It comes in a small outline package suitable for surface mount applications. Operating temperature ranges from -40 to 85°C, making it ideal for various electronic circuits.

Median Price

$0.109

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 750 parts In-Stock

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$0.109

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Flip Electronics

USA . 72,000 parts In-Stock

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Vyrian

USA . 5,889 parts In-Stock

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Digiode

USA . 1,304 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 76 parts In-Stock

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$0.107

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Continental Prestige Electronics

USA . 2,155 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$0.109

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$0.107

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Argo Parts USA

USA . 490 parts In-Stock

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$0.106

490

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$0.106

Microchip USA

USA . 7,917 parts In-Stock

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$0.642

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AZTECH Wire

Italy . 498 parts In-Stock

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$7.488

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Aztec Data Supply Inc.

USA . 4,222 parts In-Stock

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$30.869

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Ampacity Inc.

Singapore . 482 parts In-Stock

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$33.000

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482

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Semicontronic

India . 207 parts In-Stock

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$44.000

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$42.900

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$42.680

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207

$44.000

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Component Stockers USA

USA . 744 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 6,866 parts In-Stock

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TANS Electronics

Latvia . 5,528 parts In-Stock

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SupplyDigital Components

Austria . 3,482 parts In-Stock

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Problanco Electronics

Mexico . 3,353 parts In-Stock

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Corphita

USA . 1,889 parts In-Stock

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UHIMA Technologies

Türkiye . 989 parts In-Stock

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Overview

Discover the cutting-edge NC7ST32M5X-L22090 by Onsemi, a top-tier manufacturer known for producing high-quality logic gates. This versatile component is designed to deliver fast and efficient performance in a wide range of applications. With a small outline package and low profile design, it offers valuable space-saving benefits. Whether you're working on consumer electronics, automotive systems, or industrial machinery, this logic gate provides reliable functionality and precision. Elevate your projects with the superior quality and advanced technology of the NC7ST32M5X-L22090.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY is a common and durable material for electronic components, ensuring the product is reliable and long-lasting.

Propagation Delay At Nominal Supply: 31 ns

Low propagation delay ensures fast signal processing, making this product suitable for applications requiring quick response times.

Surface Mount: YES

Surface mount design allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making it easy to incorporate into existing systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Technical Specifications

Logic Gates NC7ST32M5X-L22090 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HST/T

JESD-30 Code:

R-PDSO-G5

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

2 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Maximum Power Supply Current (ICC):

25 mA

Propagation Delay At Nominal Supply:

31 ns

Propagation Delay (tpd):

31 ns

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.6 mm

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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