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NBXSPA022LNHTAG

Onsemi

NBXSPA022LNHTAG by Onsemi

NBXSPA022LNHTAG by Onsemi is a LVDS XO Clock Oscillator with 50% frequency stability, operating at 187.5 MHz. It has a max supply voltage of 3.63 V and is ideal for applications requiring precise timing in temperature-sensitive environments.

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1k+

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Vyrian

USA . 8,849 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 924 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,506 parts In-Stock

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TANS Electronics

Latvia . 4,201 parts In-Stock

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SupplyDigital Components

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Problanco Electronics

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Kulean Microsystems

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Corphita

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Microchip USA

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Corohmni

South Africa . 98 parts In-Stock

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UHIMA Technologies

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Overview

Enhance your electronic devices with the NBXSPA022LNHTAG by Onsemi, a top-of-the-line XO Clock Oscillator that guarantees precision and reliability. Manufactured by trusted brand Onsemi, this product offers unmatched quality and performance in a compact size. Ideal for various applications, this oscillator ensures stable frequencies and optimal output load for seamless functionality. Upgrade your devices today with the NBXSPA022LNHTAG and experience unparalleled value and benefits that only Onsemi can provide.

Feature Benefit Bullets

Frequency Stability: 50%

This clock oscillator offers a high level of frequency stability, ensuring reliable and accurate timing for various electronic applications.

Maximum Supply Voltage: 3.63 V

With a maximum supply voltage of 3.63 V, this oscillator can handle higher voltage levels, making it versatile and compatible with a wide range of systems.

Output Load: 100 OHM

The 100 OHM output load capability ensures efficient signal transmission and compatibility with various electronic circuits.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V provides stable power to the oscillator, ensuring reliable performance in demanding environments.

Oscillator Type: LVDS

The LVDS oscillator type offers low voltage differential signaling, which helps in reducing noise and improving signal integrity in high-speed applications.

No. of Terminals: 6

With 6 terminals, this clock oscillator can easily be integrated into various circuit designs, offering flexibility and ease of use.

Maximum Rise Time: 0.4 ms

The fast maximum rise time of 0.4 ms ensures quick signal transitions, making this oscillator suitable for high-speed applications with stringent timing requirements.

Physical Dimension: 7.0mm x 5.0mm x 1.9mm

The compact size of 7.0mm x 5.0mm x 1.9mm allows for space-efficient integration into electronic devices without compromising on performance.

Minimum Supply Voltage: 2.97 V

The minimum supply voltage of 2.97 V ensures that the oscillator can operate effectively even with lower voltage levels, providing flexibility in power supply options.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this oscillator can withstand high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40 °C ensures reliable performance even in extreme cold conditions, making this oscillator versatile in various environments.

Nominal Operating Frequency: 187.5 MHz

The nominal operating frequency of 187.5 MHz offers a precise timing reference for applications requiring high-frequency accuracy, such as data communication systems.

Maximum Fall Time: 0.4 ns

The fast maximum fall time of 0.4 ns ensures quick signal transitions, enhancing the overall performance of the oscillator in demanding applications.

Maximum Symmetry (%): 52/48

The maximum symmetry of 52/48 ensures balanced signal output, helping to maintain signal integrity and reduce signal distortion in electronic circuits.

Mounting Feature: SURFACE MOUNT

The surface mounting feature allows for easy and secure installation of the oscillator on PCBs, enabling efficient assembly and integration into electronic devices.

Technical Specifications

XO Clock Oscillators NBXSPA022LNHTAG attributes and parameters. Explore more XO Clock Oscillators devices from Onsemi

Specs

Additional Features:

SUPPLY VOLTAGE 2.5V ALSO POSSIBLE; TRI-STATE; E/D FUNCTION; DIFFERENTIAL O/P; TAPE AND REEL

Maximum Fall Time:

.4 ns

Frequency Adjustment (Mechanical):

NO

Frequency Stability:

Mounting Feature:

No. of Terminals:

6

Nominal Operating Frequency:

187.5 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Oscillator Type:

Output Load:

100 OHM

Physical Dimension:

7.0mm x 5.0mm x 1.9mm

Maximum Rise Time:

.4 ms

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Maximum Symmetry (%):

52/48

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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