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NBXSBA051LN1TAG

Onsemi

NBXSBA051LN1TAG by Onsemi

NBXSBA051LN1TAG by Onsemi is a ceramic XO Clock Oscillator with LVPECL type, operating at 533.33 MHz frequency. It has a supply voltage range of 2.97V to 3.63V and offers high stability (50%) with low power consumption (105mA). Ideal for applications requiring precise timing in temperature-sensitive environments.

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Kulean Microsystems

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UHIMA Technologies

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Overview

Experience precision and reliability with the NBXSBA051LN1TAG by Onsemi. Crafted with quality ceramic materials, this XO Clock Oscillator ensures a frequency stability of 50%. With a maximum operating temperature of 85 °C and a wide range of power supplies, this oscillator caters to various applications in electronics and communications. Trust in Onsemi's reputation for excellence in manufacturing as you benefit from the seamless performance and superior functionality that this product delivers. Elevate your projects with the unmatched value and advantages that the NBXSBA051LN1TAG brings to the table.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material offers high reliability and stability for the clock oscillator, making it suitable for various applications.

Frequency Stability: 50 %

The 50% frequency stability ensures accurate and consistent timing, making it ideal for precise timekeeping in electronic devices.

Maximum Supply Voltage: 3.63 V

With a maximum supply voltage of 3.63V, this clock oscillator can operate efficiently within the specified voltage range, ensuring reliable performance.

Output Load: 50 OHM

The 50 Ohm output load helps in matching the impedance of the oscillator with the connected circuit, enabling optimal signal transfer.

Maximum Supply Current: 105 mA

The low supply current requirement of 105mA ensures minimal power consumption, making this clock oscillator energy-efficient.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides a stable operating voltage for the clock oscillator, ensuring consistent performance.

Power Supplies (V): 2.5/3.3

The availability of multiple power supply options (2.5V/3.3V) allows flexibility in system design and compatibility with different voltage requirements.

Oscillator Type: LVPECL

The LVPECL oscillator type offers low voltage differential signaling for high-speed data transmission, making it suitable for applications requiring fast clock speeds.

No. of Terminals: 6

Having 6 terminals provides easy connectivity and integration of the clock oscillator into circuit boards, simplifying installation.

Maximum Rise Time: 0.4 ms

The fast rise time of 0.4ms ensures quick signal transitions, contributing to overall system efficiency and performance.

Physical Dimension: 7.0mm x 5.0mm x 1.9mm

The compact size of 7.0mm x 5.0mm x 1.9mm allows for space-saving installation in electronic devices with limited board space.

Minimum Supply Voltage: 2.97 V

The minimum supply voltage of 2.97V ensures reliable operation even under low voltage conditions, enhancing the oscillator's versatility.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C enables the clock oscillator to withstand elevated environmental temperatures, ensuring reliable performance in various conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the clock oscillator to function in cold environments without any performance degradation.

Nominal Operating Frequency: 533.33 MHz

The high nominal operating frequency of 533.33MHz provides fast and accurate clock signals, making it suitable for high-performance electronic devices.

Maximum Fall Time: 0.4 ns

The fast fall time of 0.4ns ensures quick signal transitions, contributing to high-speed and reliable data transmission.

Maximum Symmetry (%): 52/48

The 52/48 maximum symmetry percentage indicates balanced signal timing, ensuring accurate synchronization between clock signals in electronic systems.

Mounting Feature: SURFACE MOUNT

The surface mounting feature allows for easy and secure installation of the clock oscillator on PCBs, enhancing convenience and reliability during assembly.

Technical Specifications

XO Clock Oscillators NBXSBA051LN1TAG attributes and parameters. Explore more XO Clock Oscillators devices from Onsemi

Specs

Additional Features:

TRI-STATE; ENABLE/DISABLE FUNCTION; TR; 2.5V NOMINAL VOLTAGE ALSO AVAILABLE

Maximum Fall Time:

.4 ns

Frequency Adjustment (Mechanical):

NO

Frequency Stability:

Mounting Feature:

No. of Terminals:

6

Nominal Operating Frequency:

533.33 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Oscillator Type:

Output Load:

50 OHM

Package Body Material:

CERAMIC

Package Equivalence Code:

DILCC6,.2

Physical Dimension:

7.0mm x 5.0mm x 1.9mm

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Rise Time:

.4 ms

Sub-Category:

Other Oscillators

Maximum Supply Current:

105 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Maximum Symmetry (%):

52/48

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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