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NBC12439AMNR4G

Onsemi

NBC12439AMNR4G by Onsemi

The Onsemi NBC12439AMNR4G clock generator operates at a max output frequency of 800MHz with a supply voltage range of 3.135V to 3.465V. This CMOS technology chip carrier is ideal for industrial applications requiring precise timing and clock generation in a compact, surface-mount package. With a wide temperature range from -40 °C to 85°C, it offers reliability and performance in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,689 parts In-Stock

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2,689

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Digiode

USA . 589 parts In-Stock

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589

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Ampacity Inc.

Singapore . 1,398 parts In-Stock

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$8.000

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1,398

$8.000

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AZTECH Wire

Italy . 62 parts In-Stock

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$12.660

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62

$12.660

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Component Stockers USA

USA . 706 parts In-Stock

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$99.990

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706

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 24,809 parts In-Stock

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24,809

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A-Z Elektronik GmbH

Germany . 7,350 parts In-Stock

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7,350

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Kulean Microsystems

USA . 6,076 parts In-Stock

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Microchip USA

USA . 4,970 parts In-Stock

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Problanco Electronics

Mexico . 3,088 parts In-Stock

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SupplyDigital Components

Austria . 2,091 parts In-Stock

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2,091

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TANS Electronics

Latvia . 1,786 parts In-Stock

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1,786

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Corphita

USA . 1,701 parts In-Stock

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UHIMA Technologies

Türkiye . 760 parts In-Stock

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Corohmni

South Africa . 478 parts In-Stock

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Metaverse IC Inc.

Canada . 135 parts In-Stock

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135

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Speed Components Ltd (Excess)

Israel . 121 parts In-Stock

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Kepictronics

USA . 85 parts In-Stock

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Overview

Enhance your electronic devices with the NBC12439AMNR4G clock generator by Onsemi, a top-tier manufacturer known for quality and reliability. Designed for a wide range of applications, this clock generator offers seamless integration and precise timing control, ensuring optimal performance. With a maximum output clock frequency of 800 MHz and a nominal supply voltage of 3.3V, this product provides unparalleled value and efficiency to customers seeking cutting-edge technology. Upgrade your systems today with the NBC12439AMNR4G and experience superior functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and providing a reliable connection.

Maximum Supply Voltage: 3.465 V

Provides a wide range of voltage compatibility, ensuring stable performance in various voltage environments.

Package Shape: SQUARE

The square shape makes the product easy to integrate into circuit designs and ensures uniformity in layout.

Maximum Output Clock Frequency: 800 MHz

High output clock frequency allows for fast data processing and synchronization, suitable for high-performance systems.

No. of Terminals: 32

A high number of terminals provide flexibility in connecting to other components and peripherals, enhancing overall functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile makes the product efficient in dissipating heat and saves space in compact designs.

Minimum Supply Voltage: 3.135 V

The minimum supply voltage ensures stable operation even at lower voltage levels, improving energy efficiency and reliability.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can function reliably in demanding industrial environments without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to operate in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance, ensuring long-term reliability of connections.

Terminal Position: QUAD

Quad terminal position offers multiple connection options and simplifies integration into circuit layouts, improving overall design flexibility.

Maximum Seated Height: 1 mm

Low maximum seated height allows for a compact and slim profile, ideal for space-constrained applications.

Width: 5 mm

The width of 5 mm provides a balance between compact size and ease of handling during installation and maintenance.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and assembly, contributing to the product's overall reliability and durability.

Length: 5 mm

The length of 5 mm complements the width measurement, maintaining a square shape that aids in uniform layout design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the product can withstand harsh temperature conditions commonly found in industrial settings.

Peripheral IC Type: CLOCK GENERATOR, OTHER

The peripheral IC type of clock generator and others indicates versatile functionality and compatibility with various peripheral devices, expanding application possibilities.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable performance, making the product energy-efficient and dependable.

Terminal Form: NO LEAD

No lead terminal form complies with RoHS regulations, providing an environmentally friendly and safe solution for electronic applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is a common standard in electronics, ensuring compatibility with a wide range of devices and power sources.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for dense packing of terminals, saving space and enabling high-density circuit designs.

Nominal Primary Clock/Crystal Frequency: 20 MHz

The nominal primary clock/crystal frequency of 20 MHz offers a stable reference for timing operations, ensuring accuracy in data processing and synchronization.

Technical Specifications

Clock Generators NBC12439AMNR4G attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e3

Length:

5 mm

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

800 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Nominal Primary Clock/Crystal Frequency:

20 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Trade Compliance

NBC12439AMNR4G Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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