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NBC12429AFAR2

Onsemi

NBC12429AFAR2 by Onsemi

The Onsemi NBC12429AFAR2 clock generator operates at a max output frequency of 400 MHz, with a supply voltage range of 3.135V to 3.465V. This IC is designed for industrial applications, featuring a quad terminal position and Gull Wing form factor in a low-profile flatpack package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,367 parts In-Stock

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Vyrian

USA . 305 parts In-Stock

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Component Stockers USA

USA . 462 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 6,600 parts In-Stock

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Problanco Electronics

Mexico . 5,847 parts In-Stock

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SupplyDigital Components

Austria . 2,798 parts In-Stock

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Corphita

USA . 2,223 parts In-Stock

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Microchip USA

USA . 403 parts In-Stock

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TANS Electronics

Latvia . 272 parts In-Stock

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Corohmni

South Africa . 200 parts In-Stock

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UHIMA Technologies

Türkiye . 67 parts In-Stock

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Overview

Experience enhanced performance and precision with the NBC12429AFAR2 clock generator from Onsemi. Crafted with quality materials and cutting-edge technology, this product is designed to deliver reliable clock signals for a wide range of applications. Whether you're in need of high-frequency outputs or industrial-grade temperature tolerance, this clock generator has you covered. Stay ahead of the curve with Onsemi's innovative solutions that provide unmatched value and benefits to customers looking for top-notch performance. Elevate your projects with the NBC12429AFAR2 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and lightweight design for easy integration into various electronic devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 3.465 V

Supports a wide range of supply voltages, making it compatible with various power sources and applications.

Maximum Output Clock Frequency: 400 MHz

High output clock frequency enables fast and efficient operation, suitable for demanding digital systems and applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable performance in harsh operating environments, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and stable operation.

Technical Specifications

Clock Generators NBC12429AFAR2 attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

Additional Features:

ALSO OPRATES AT 5V SUPPLY

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e0

Length:

7 mm

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

400 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Nominal Primary Clock/Crystal Frequency:

20 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

NBC12429AFAR2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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