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NBC12429FN

Onsemi

NBC12429FN by Onsemi

The Onsemi NBC12429FN clock generator operates at a max output frequency of 400 MHz with a supply voltage range of 3.135V to 3.465V. This CMOS technology chip carrier is ideal for commercial applications requiring precise clock generation in a compact square package, suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

< 1k

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Vyrian

USA . 674 parts In-Stock

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Digiode

USA . 55 parts In-Stock

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Sea View Technologies

USA . 16 parts In-Stock

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Bristol Electronics

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A-Z Elektronik GmbH

Germany . 7,035 parts In-Stock

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Kulean Microsystems

USA . 6,917 parts In-Stock

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TANS Electronics

Latvia . 4,149 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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Problanco Electronics

Mexico . 2,619 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,517 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Corphita

USA . 1,945 parts In-Stock

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UHIMA Technologies

Türkiye . 580 parts In-Stock

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Corohmni

South Africa . 358 parts In-Stock

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Microchip USA

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SupplyDigital Components

Austria . 138 parts In-Stock

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Overview

Enhance your electronic devices with the NBC12429FN Clock Generator by Onsemi, a high-quality product that guarantees reliable performance. Onsemi's reputation for excellence in manufacturing ensures top-notch durability and precision. Ideal for a wide range of applications, this clock generator offers unparalleled value, delivering precise clock signals up to 400 MHz. Elevate your projects with the NBC12429FN and experience the advantages of seamless integration and optimal functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the clock generator easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy PCB assembly and saves space on the board, making the product efficient in terms of design.

Maximum Supply Voltage: 3.465 V

The high maximum supply voltage ensures compatibility with a wide range of electronic devices, providing flexibility in application.

Package Shape: SQUARE

The square shape allows for efficient use of board space and easy placement on the PCB.

Maximum Output Clock Frequency: 400 MHz

The high maximum output clock frequency allows for high-speed data processing and performance in various applications.

No. of Terminals: 28

Having 28 terminals provides multiple connection points, enabling the clock generator to interface with other components effectively.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is compact and suitable for surface mounting, contributing to the overall efficiency of the product.

Minimum Supply Voltage: 3.135 V

The low minimum supply voltage ensures reliable operation even in low-power situations, making the product versatile.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows the clock generator to function in a wide range of environments without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the clock generator can operate in colder conditions without any issues.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and electrical conductivity, ensuring reliable connections for effective performance.

Terminal Position: QUAD

The quad terminal position allows for easy alignment and connection on the PCB, simplifying the assembly process.

Maximum Seated Height: 4.57 mm

The low maximum seated height helps in achieving a compact design and efficient use of space on the PCB.

Width: 11.505 mm

The width of 11.505 mm ensures the clock generator can fit comfortably on the PCB without taking up too much space.

Peak Reflow Temperature °C: 235

The high peak reflow temperature ensures proper soldering during assembly, leading to reliable connections and performance.

Length: 11.505 mm

The length of 11.505 mm complements the width and square shape, providing a compact form factor for efficient PCB layout.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades means the clock generator is suitable for standard operating conditions in most applications.

Peripheral IC Type: CLOCK GENERATOR, OTHER

The clock generator falls under the peripheral integrated circuits category, offering essential functionality for various electronic devices.

Technology: CMOS

CMOS technology ensures low power consumption and compatibility with a wide range of digital systems, making the clock generator energy-efficient.

Terminal Form: J BEND

The J bend terminal form simplifies the soldering process and provides mechanical strength for secure connections on the PCB.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3 V ensures stable operation and compatibility with standard electronic components in the circuit.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for easy soldering and board layout, facilitating efficient connection with other components.

Nominal Primary Clock/Crystal Frequency: 20 MHz

The 20 MHz primary clock/crystal frequency provides a stable reference for time-keeping and synchronization in electronic systems.

Technical Specifications

Clock Generators NBC12429FN attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

Additional Features:

ALSO OPRATES AT 5V SUPPLY

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

400 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Nominal Primary Clock/Crystal Frequency:

20 MHz

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Peripheral IC Type:

Trade Compliance

NBC12429FN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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