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NBC12429FNR2

Onsemi

NBC12429FNR2 by Onsemi

The Onsemi NBC12429FNR2 clock generator operates at a max output frequency of 400 MHz with a supply voltage range of 3.135V to 3.465V. This CMOS technology chip carrier is designed for commercial applications requiring precise clock generation in a compact square package, suitable for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 914 parts In-Stock

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Digiode

USA . 278 parts In-Stock

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278

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Andel Nordic

Denmark . 1,154 parts In-Stock

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$2.398

100+ parts

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$2.302

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$2.302

1,154

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$2.302

SupplyDigital Components

Austria . 8,354 parts In-Stock

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TANS Electronics

Latvia . 3,268 parts In-Stock

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Kulean Microsystems

USA . 1,511 parts In-Stock

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Corphita

USA . 566 parts In-Stock

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UHIMA Technologies

Türkiye . 497 parts In-Stock

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Corohmni

South Africa . 428 parts In-Stock

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Problanco Electronics

Mexico . 359 parts In-Stock

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Microchip USA

USA . 336 parts In-Stock

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Overview

Enhance your electronic devices with the NBC12429FNR2 clock generator by Onsemi, a top-quality product designed to optimize performance and reliability. Crafted by the reputable manufacturer, Onsemi, this clock generator offers a wide range of applications in various industries. Experience seamless functionality and precision timing with this innovative product, providing unmatched value and benefits to customers seeking cutting-edge solutions for their electronic needs. Elevate your projects with the NBC12429FNR2 clock generator and enjoy superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This package material is durable and lightweight, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving time and effort.

Maximum Supply Voltage: 3.465 V

The higher maximum supply voltage provides flexibility in power requirements for the product.

Package Shape: SQUARE

The square package shape helps in easy placement and alignment on the PCB.

Maximum Output Clock Frequency: 400 MHz

The high maximum output clock frequency ensures efficient performance in demanding applications.

No. of Terminals: 28

The ample number of terminals allow for versatile connectivity options with other components.

Minimum Supply Voltage: 3.135 V

The lower minimum supply voltage helps in reducing power consumption and increasing efficiency.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range ensures reliability and performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

The product can operate in a wide temperature range, making it suitable for diverse applications.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides good solderability and connectivity for long-term reliability.

Terminal Position: QUAD

The quad-terminal configuration allows for efficient signal routing and connectivity.

Maximum Seated Height: 4.57 mm

The low seated height helps in compact and slim designs of the product.

Width: 11.505 mm

The compact width allows for space-saving integration on the PCB.

Peak Reflow Temperature °C: 235

The high peak reflow temperature ensures proper soldering and reliability during assembly.

Length: 11.505 mm

The compact length of the product allows for efficient placement on the PCB.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation in standard temperature environments.

Peripheral IC Type: CLOCK GENERATOR, OTHER

The clock generator functionality along with other peripheral ICs provide versatile features for different applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: J BEND

The J bend terminal form facilitates easy installation and soldering onto PCBs.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage provides stable power input for consistent performance.

Terminal Pitch: 1.27 mm

The terminal pitch allows for easy connection and routing of signals on the PCB.

Nominal Primary Clock/Crystal Frequency: 20 MHz

The nominal primary clock/crystal frequency sets the base frequency for clock generation and synchronization.

Technical Specifications

Clock Generators NBC12429FNR2 attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

Additional Features:

ALSO OPRATES AT 5V SUPPLY

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

400 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Nominal Primary Clock/Crystal Frequency:

20 MHz

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Peripheral IC Type:

Trade Compliance

NBC12429FNR2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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