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NBC12430AMNG

Onsemi

NBC12430AMNG by Onsemi

CLOCK GENERATOR, OTHER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$11.752

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 73 parts In-Stock

1+ parts

$14.900

100+ parts

$9.620

1k+ parts

$9.310

10k+ parts

-

73

$14.900

$9.620

$9.310

-

DigiKey

USA . 37 parts In-Stock

1+ parts

$14.900

100+ parts

$10.303

1k+ parts

$9.478

10k+ parts

$9.277

37

$14.900

$10.303

$9.478

$9.277

Chip1Stop

Japan . 95 parts In-Stock

1+ parts

$31.500

100+ parts

-

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-

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95

$31.500

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-

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Verical

USA . 1,924 parts In-Stock

1+ parts

-

100+ parts

$8.604

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-

10k+ parts

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1,924

-

$8.604

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-

Rochester

USA . 1,550 parts In-Stock

1+ parts

-

100+ parts

$8.530

1k+ parts

$7.630

10k+ parts

$7.180

1,550

-

$8.530

$7.630

$7.180

Flip Electronics (Authorized)

USA . 814 parts In-Stock

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814

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Arrow

USA . 69 parts In-Stock

1+ parts

-

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$8.599

1k+ parts

$8.489

10k+ parts

-

69

-

$8.599

$8.489

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,154 parts In-Stock

1+ parts

$9.025

100+ parts

-

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1,154

$9.025

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Vyrian

USA . 8,743 parts In-Stock

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8,743

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Flip Electronics

USA . 492 parts In-Stock

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492

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Chip Stock

USA . 309 parts In-Stock

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309

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Prism Electronics

USA . 135 parts In-Stock

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135

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,248 parts In-Stock

1+ parts

$8.550

100+ parts

-

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2,248

$8.550

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Corohmni

South Africa . 497 parts In-Stock

1+ parts

$9.500

100+ parts

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497

$9.500

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Component Stockers USA

USA . 125 parts In-Stock

1+ parts

$14.010

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125

$14.010

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Microchip USA

USA . 1,459 parts In-Stock

1+ parts

$42.644

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1,459

$42.644

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Perfect Parts

USA . 5,008 parts In-Stock

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5,008

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SupplyDigital Components

Austria . 3,508 parts In-Stock

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3,508

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Problanco Electronics

Mexico . 3,419 parts In-Stock

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3,419

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TANS Electronics

Latvia . 3,095 parts In-Stock

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3,095

-

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Kulean Microsystems

USA . 1,338 parts In-Stock

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1,338

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UHIMA Technologies

Türkiye . 367 parts In-Stock

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367

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GreenTree Electronics

Israel . 195 parts In-Stock

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195

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Authorized Procurement Solutions

USA . 95 parts In-Stock

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95

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Technical Specifications

Clock Generators NBC12430AMNG attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

Additional Features:

IT CAN ALSO OPERATES WITH 5V

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

800 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Nominal Primary Clock/Crystal Frequency:

20 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

NBC12430AMNG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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