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NB7VPQ702MMUTXG

Onsemi

NB7VPQ702MMUTXG by Onsemi

NB7VPQ702MMUTXG by Onsemi is a square-shaped chip carrier with 16 terminals. It operates b/w -40 to 85 °C and has a supply voltage range of 1.71V to 1.89V. This interface circuit IC is ideal for industrial applications requiring very thin profile components.

Median Price

$1.610

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,980 parts In-Stock

1+ parts

$0.313

100+ parts

$0.294

1k+ parts

$0.279

10k+ parts

-

2,980

$0.313

$0.294

$0.279

-

Rochester

USA . 27,000 parts In-Stock

1+ parts

-

100+ parts

$1.610

1k+ parts

$1.340

10k+ parts

$1.190

27,000

-

$1.610

$1.340

$1.190

Verical

USA . 27,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.675

10k+ parts

$1.488

27,000

-

-

$1.675

$1.488

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,485 parts In-Stock

1+ parts

$0.297

100+ parts

-

1k+ parts

-

10k+ parts

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2,485

$0.297

-

-

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$1.307

100+ parts

-

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-

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150

$1.307

-

-

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Bristol Electronics

USA . 8,963 parts In-Stock

1+ parts

-

100+ parts

$0.956

1k+ parts

$0.842

10k+ parts

-

8,963

-

$0.956

$0.842

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Dan-Mar Components

USA . 8,963 parts In-Stock

1+ parts

-

100+ parts

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8,963

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ACDS - Activité Composants Distribution Service

France . 6,000 parts In-Stock

1+ parts

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6,000

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Vyrian

USA . 5,944 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,944

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 14,640 parts In-Stock

1+ parts

$0.252

100+ parts

-

1k+ parts

-

10k+ parts

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14,640

$0.252

-

-

-

Corphita

USA . 142 parts In-Stock

1+ parts

$0.282

100+ parts

-

1k+ parts

-

10k+ parts

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142

$0.282

-

-

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Corohmni

South Africa . 313 parts In-Stock

1+ parts

$0.297

100+ parts

-

1k+ parts

-

10k+ parts

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313

$0.297

-

-

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$1.281

100+ parts

-

1k+ parts

$1.230

10k+ parts

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100

$1.281

-

$1.230

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AZTECH Wire

Italy . 1,030 parts In-Stock

1+ parts

$8.470

100+ parts

-

1k+ parts

-

10k+ parts

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1,030

$8.470

-

-

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Continental Prestige Electronics

USA . 27,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.994

10k+ parts

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27,000

-

-

$0.994

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Perfect Parts

USA . 22,960 parts In-Stock

1+ parts

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22,960

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SupplyDigital Components

Austria . 8,014 parts In-Stock

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8,014

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TANS Electronics

Latvia . 7,058 parts In-Stock

1+ parts

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7,058

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Problanco Electronics

Mexico . 6,113 parts In-Stock

1+ parts

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6,113

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GreenTree Electronics

Israel . 2,900 parts In-Stock

1+ parts

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2,900

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Kulean Microsystems

USA . 556 parts In-Stock

1+ parts

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556

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UHIMA Technologies

Türkiye . 498 parts In-Stock

1+ parts

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498

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Microchip USA

USA . 233 parts In-Stock

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233

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Overview

Upgrade your electronic devices with the NB7VPQ702MMUTXG by Onsemi, a high-quality interface IC that guarantees superior performance and reliability. Designed by the reputable manufacturer Onsemi, this product is perfect for a wide range of applications in various industries. Its surface mount feature makes installation a breeze, while its compact square package ensures efficient use of space. With a nominal supply voltage of 1.8V and a maximum operating temperature of 85°C, this IC offers unmatched value and benefits to customers looking for a reliable solution for their electronic needs. Experience the advantages of the NB7VPQ702MMUTXG today!

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort.

Maximum Supply Voltage: 1.89 V

Provides a high maximum supply voltage, offering flexibility in power requirements.

Package Shape: SQUARE

Square packages are space-efficient and can be easily placed on circuit boards.

No. of Terminals: 16

Having 16 terminals allows for more connectivity options and versatility in use.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile ensures optimal heat dissipation and space-saving design.

Minimum Supply Voltage: 1.71 V

With a low minimum supply voltage, this IC can operate efficiently even in low-power scenarios.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can function reliably even in extremely low temperatures, widening its application range.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability for reliable connections.

Terminal Position: QUAD

Quad terminal positioning allows for easy and organized connections on the PCB.

Maximum Seated Height: 0.55 mm

The low seated height enables a compact overall design for the product.

Width: 3 mm

A compact width allows for efficient space utilization on the circuit board.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly processes for durability.

Length: 3 mm

The small length contributes to the overall compact size of the product.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments where temperature variations are common.

Terminal Form: NO LEAD

No-lead terminal form ensures compliance with environmental regulations and improved reliability.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage is in the middle range, providing a balanced operating point for the IC.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density packaging and increased connectivity options.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically as an interface circuit, ensuring reliable communication between different components.

Technical Specifications

Other Function Interface ICs NB7VPQ702MMUTXG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.55 mm

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

NB7VPQ702MMUTXG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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