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NB7VPQ16MMNHTBG

Onsemi

NB7VPQ16MMNHTBG by Onsemi

NB7VPQ16MMNHTBG by Onsemi is a 16-terminal interface IC with a square package shape and terminal finish of nickel gold palladium. It operates b/w -40 to 85 °C, with a supply voltage range of 1.71V to 2.625V. Ideal for industrial applications requiring very thin profile chips in surface mount configurations.

Median Price

$7.813

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,100 parts In-Stock

1+ parts

-

100+ parts

$6.250

1k+ parts

$5.590

10k+ parts

$5.260

5,100

-

$6.250

$5.590

$5.260

DigiKey

USA . 5,100 parts In-Stock

1+ parts

-

100+ parts

$8.230

1k+ parts

-

10k+ parts

-

5,100

-

$8.230

-

-

Verical

USA . 2,700 parts In-Stock

1+ parts

-

100+ parts

$7.813

1k+ parts

$6.987

10k+ parts

$6.575

2,700

-

$7.813

$6.987

$6.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 980 parts In-Stock

1+ parts

$6.593

100+ parts

-

1k+ parts

-

10k+ parts

-

980

$6.593

-

-

-

Chip Stock

USA . 55,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

55,000

-

-

-

-

Vyrian

USA . 7,113 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,113

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 385 parts In-Stock

1+ parts

$6.246

100+ parts

-

1k+ parts

-

10k+ parts

-

385

$6.246

-

-

-

Corohmni

South Africa . 177 parts In-Stock

1+ parts

$6.940

100+ parts

-

1k+ parts

-

10k+ parts

-

177

$6.940

-

-

-

Component Stockers USA

USA . 4,156 parts In-Stock

1+ parts

$7.120

100+ parts

$6.690

1k+ parts

$6.060

10k+ parts

-

4,156

$7.120

$6.690

$6.060

-

AZTECH Wire

Italy . 288 parts In-Stock

1+ parts

$12.530

100+ parts

-

1k+ parts

-

10k+ parts

-

288

$12.530

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

SupplyDigital Components

Austria . 6,399 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,399

-

-

-

-

Problanco Electronics

Mexico . 6,299 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,299

-

-

-

-

TANS Electronics

Latvia . 4,124 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,124

-

-

-

-

Kulean Microsystems

USA . 3,066 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,066

-

-

-

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UHIMA Technologies

Türkiye . 248 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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248

-

-

-

-

Microchip USA

USA . 114 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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114

-

-

-

-

Overview

Discover the unparalleled quality and reliability of the NB7VPQ16MMNHTBG by Onsemi. This cutting-edge interface IC offers a wide range of applications, from consumer electronics to industrial automation. With Onsemi's reputation for excellence in manufacturing, you can trust that this product will exceed your expectations. Experience seamless integration, superior performance, and unmatched value with the NB7VPQ16MMNHTBG. Elevate your projects to new heights with this innovative solution.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for a smaller form factor and higher component density on the PCB, making this product suitable for compact electronic devices.

Maximum Supply Voltage: 2.625 V

With a higher maximum supply voltage, this product can handle a wider range of input voltages, providing flexibility in various power supply configurations.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and facilitates easy orientation during assembly, making it convenient for PCB layout.

No. of Terminals: 16

Having a higher number of terminals enables more connections and functionalities in a single component, making it versatile for different interface applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers excellent thermal management and compact design, ensuring reliable performance in space-constrained environments.

Minimum Supply Voltage: 1.71 V

With a low minimum supply voltage, this product can operate efficiently even with lower power sources, increasing the range of compatible power supplies for various applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in harsh environments or under heavy load conditions, making this product suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to function in cold environments without performance degradation, enhancing its versatility in different operational conditions.

Terminal Finish: NICKEL GOLD PALLADIUM

The use of nickel, gold, and palladium terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring long-term reliability and durability of the product.

Terminal Position: QUAD

The quad terminal position allows for easy and secure PCB mounting, reducing assembly time and improving overall product reliability.

Maximum Seated Height: 1 mm

The low maximum seated height contributes to a slim profile and space-saving design, making this product suitable for compact electronic devices or applications with height restrictions.

Width: 3 mm

The compact width of 3 mm enables easy placement on the PCB without occupying excessive space, enhancing flexibility in board layout and reducing overall system size.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds ensures the integrity of the component during soldering processes, preventing thermal damage and ensuring reliable connections.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260 °C, this product can withstand the soldering process without performance degradation, ensuring robust solder joints and long-term reliability.

Length: 3 mm

The compact length of 3 mm contributes to a space-efficient design, allowing for flexible placement on the PCB and enabling compact electronic product designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that this product can operate reliably in a wide temperature range, making it suitable for industrial applications with demanding operating conditions.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the use of lead, making this product environmentally friendly and compliant with RoHS regulations, contributing to sustainable and eco-friendly designs.

Nominal Supply Voltage: 1.8 V

With a nominal supply voltage of 1.8 V, this product is optimized for efficient operation at the specified voltage level, ensuring stable performance and compatibility with standard power sources.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5 mm enables high-density mounting on the PCB, enhancing the component's flexibility in board layout and allowing for compact and space-efficient designs.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product facilitates communication and data exchange between different components or systems, enabling seamless integration and efficient functionality in various electronic applications.

Technical Specifications

Other Function Interface ICs NB7VPQ16MMNHTBG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB7VPQ16MMNHTBG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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