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NB7VPQ16MMNTXG

Onsemi

NB7VPQ16MMNTXG by Onsemi

NB7VPQ16MMNTXG by Onsemi is a 16-terminal interface IC with a supply voltage range of 1.71V to 2.625V, suitable for industrial applications. Featuring a square package style and nickel gold palladium terminal finish, it operates in temperatures from -40 °C to 85°C. This surface-mount chip carrier is designed for other function interface requirements.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 65,000 parts In-Stock

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Vyrian

USA . 3,898 parts In-Stock

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Digiode

USA . 470 parts In-Stock

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AZTECH Wire

Italy . 808 parts In-Stock

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$12.450

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USA . 10,000 parts In-Stock

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TANS Electronics

Latvia . 6,918 parts In-Stock

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SupplyDigital Components

Austria . 6,212 parts In-Stock

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Kulean Microsystems

USA . 3,214 parts In-Stock

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Problanco Electronics

Mexico . 1,860 parts In-Stock

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UHIMA Technologies

Türkiye . 918 parts In-Stock

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Microchip USA

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Overview

Discover the unparalleled quality and innovation of the NB7VPQ16MMNTXG by Onsemi, a cutting-edge product in the category of Other Function Interface ICs. With a sleek surface mount design and a wide operating temperature range, this chip carrier boasts reliability and durability for industrial applications. Its advanced technology and precision engineering ensure seamless performance and optimal functionality. Experience the value and benefits of Onsemi's exceptional manufacturing standards with the NB7VPQ16MMNTXG, offering customers unparalleled advantages in interface circuit solutions.

Feature Benefit Bullets

Surface Mount: YES

This allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 2.625 V

Provides a wide range of voltage compatibility, making it versatile for different applications.

Package Shape: SQUARE

Square package shape can help optimize space on a PCB and ease of routing.

No. of Terminals: 16

Having 16 terminals provides enough connections for various functions and interfaces.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This unique package style offers efficient heat dissipation and compact design.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this IC can withstand demanding environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme low temperatures, suitable for a wide range of applications.

Terminal Finish: NICKEL GOLD PALLADIUM

This finish provides excellent conductivity and corrosion resistance for reliable performance.

Terminal Position: QUAD

Quad terminal position allows for easier soldering and connection of multiple external components.

Maximum Seated Height: 1 mm

Low seated height helps in designing slim and compact devices.

Width: 3 mm

Compact width allows for space-saving integration onto PCBs.

Length: 3 mm

Square shape with a length of 3mm provides a balanced footprint on the PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliability in harsh operating conditions.

Terminal Form: NO LEAD

Lead-free terminal form is environmentally friendly and compliant with regulations.

Nominal Supply Voltage: 1.8 V

Stable supply voltage for consistent performance in various applications.

Terminal Pitch: 0.5 mm

Close terminal pitch facilitates high-density PCB designs and compact layout.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interface circuits, providing optimized functionality and performance.

Technical Specifications

Other Function Interface ICs NB7VPQ16MMNTXG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

NB7VPQ16MMNTXG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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