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NB7NPQ1102MMTTWG

Onsemi

NB7NPQ1102MMTTWG by Onsemi

NB7NPQ1102MMTTWG by Onsemi is a consumer IC with 30 terminals in a chip carrier package. It operates b/w -40 to 85°C, suitable for industrial applications. With a terminal pitch of 0.4mm and no lead terminal form, it has a min supply voltage of 3V and max of 3.6V.

Median Price

$1.313

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,720 parts In-Stock

1+ parts

$2.040

100+ parts

$1.223

1k+ parts

$1.076

10k+ parts

$1.002

2,720

$2.040

$1.223

$1.076

$1.002

Rochester

USA . 104,163 parts In-Stock

1+ parts

-

100+ parts

$1.270

1k+ parts

$1.050

10k+ parts

$0.940

104,163

-

$1.270

$1.050

$0.940

Verical

USA . 101,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.313

10k+ parts

$1.175

101,680

-

-

$1.313

$1.175

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 801 parts In-Stock

1+ parts

$0.988

100+ parts

-

1k+ parts

-

10k+ parts

-

801

$0.988

-

-

-

Vyrian

USA . 946 parts In-Stock

1+ parts

$1.040

100+ parts

-

1k+ parts

-

10k+ parts

-

946

$1.040

-

-

-

Flip Electronics

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,892 parts In-Stock

1+ parts

$0.936

100+ parts

-

1k+ parts

-

10k+ parts

-

1,892

$0.936

-

-

-

Corohmni

South Africa . 475 parts In-Stock

1+ parts

$1.023

100+ parts

-

1k+ parts

-

10k+ parts

-

475

$1.023

-

-

-

Microchip USA

USA . 3,964 parts In-Stock

1+ parts

$15.275

100+ parts

-

1k+ parts

-

10k+ parts

-

3,964

$15.275

-

-

-

Authorized Procurement Solutions

USA . 80,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

80,000

-

-

-

-

Lixinc

USA . 8,889 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,889

-

-

-

-

Kulean Microsystems

USA . 5,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,500

-

-

-

-

SupplyDigital Components

Austria . 3,191 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,191

-

-

-

-

TANS Electronics

Latvia . 2,286 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,286

-

-

-

-

Problanco Electronics

Mexico . 2,039 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,039

-

-

-

-

UHIMA Technologies

Türkiye . 788 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

788

-

-

-

-

Overview

Discover the NB7NPQ1102MMTTWG by Onsemi, a top-of-the-line consumer IC that promises unrivaled quality and reliability. Manufactured by industry leader Onsemi, this chip carrier with a very thin profile offers a wide range of applications in various industries. With a maximum supply voltage of 3.6V and industrial-grade temperature grade, this versatile IC provides exceptional performance for your electronic devices. Trust in Onsemi's expertise and innovation to bring value and efficiency to your projects with the NB7NPQ1102MMTTWG.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on PCBs, making this product suitable for automated assembly processes.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and provides good compatibility with existing hardware and equipment.

No. of Terminals: 30

With 30 terminals, this product offers a high level of connectivity and versatility for various circuit configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh industrial environments.

Minimum Operating Temperature: -40 °C

The wide temperature range allows this product to function effectively in both hot and cold conditions.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6V ensures compatibility with a wide range of power sources and applications.

Technical Specifications

Other Function Consumer ICs NB7NPQ1102MMTTWG attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-XQCC-N30

JESD-609 Code:

e3

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.5 mm

Trade Compliance

NB7NPQ1102MMTTWG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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