Loading...

NB7NPQ1002MMTTWG

Onsemi

NB7NPQ1002MMTTWG by Onsemi

NB7NPQ1002MMTTWG by Onsemi is a consumer IC with 30 terminals in a chip carrier package. It operates b/w -40 to 85°C, with supply voltage ranging from 3V to 3.6V. This industrial-grade IC is ideal for applications requiring very thin profile and quad terminal position.

Median Price

$1.784

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,000 parts In-Stock

1+ parts

$2.410

100+ parts

$1.632

1k+ parts

$1.101

10k+ parts

$1.010

3,000

$2.410

$1.632

$1.101

$1.010

Chip1Stop

Japan . 2,990 parts In-Stock

1+ parts

$7.430

100+ parts

$3.110

1k+ parts

$1.950

10k+ parts

-

2,990

$7.430

$3.110

$1.950

-

Flip Electronics (Authorized)

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,000

-

-

-

-

Rochester

USA . 13,828 parts In-Stock

1+ parts

-

100+ parts

$1.370

1k+ parts

$1.140

10k+ parts

$1.010

13,828

-

$1.370

$1.140

$1.010

Verical

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.425

10k+ parts

$1.262

12,000

-

-

$1.425

$1.262

RS (Exports)

UK . 2,990 parts In-Stock

1+ parts

-

100+ parts

$1.784

1k+ parts

$1.509

10k+ parts

$1.404

2,990

-

$1.784

$1.509

$1.404

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 980 parts In-Stock

1+ parts

$1.064

100+ parts

-

1k+ parts

-

10k+ parts

-

980

$1.064

-

-

-

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$1.116

100+ parts

-

1k+ parts

-

10k+ parts

-

900

$1.116

-

-

-

Flip Electronics

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,000

-

-

-

-

Vyrian

USA . 8,921 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,921

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,986 parts In-Stock

1+ parts

$0.950

100+ parts

-

1k+ parts

-

10k+ parts

-

8,986

$0.950

-

-

-

Corphita

USA . 1,194 parts In-Stock

1+ parts

$1.008

100+ parts

-

1k+ parts

-

10k+ parts

-

1,194

$1.008

-

-

-

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$1.116

100+ parts

$1.060

1k+ parts

$1.007

10k+ parts

$0.993

300

$1.116

$1.060

$1.007

$0.993

Corohmni

South Africa . 51 parts In-Stock

1+ parts

$1.120

100+ parts

-

1k+ parts

-

10k+ parts

-

51

$1.120

-

-

-

Kulean Microsystems

USA . 5,614 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,614

-

-

-

-

TANS Electronics

Latvia . 4,972 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,972

-

-

-

-

GreenTree Electronics

Israel . 2,990 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,990

-

-

-

-

Authorized Procurement Solutions

USA . 2,890 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,890

-

-

-

-

SupplyDigital Components

Austria . 2,337 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,337

-

-

-

-

Problanco Electronics

Mexico . 1,485 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,485

-

-

-

-

UHIMA Technologies

Türkiye . 875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

875

-

-

-

-

Overview

Enhance your consumer electronic devices with the NB7NPQ1002MMTTWG by Onsemi, a top-quality product that guarantees reliability and performance. With Onsemi's reputation for excellence in manufacturing, this chip carrier offers superior functionality in a compact rectangular package. Ideal for a wide range of applications, this consumer circuit provides value and benefits to customers looking for high-quality components. Upgrade your products today with the NB7NPQ1002MMTTWG by Onsemi.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and efficient installation, making this product suitable for automated assembly processes.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and provides a good balance of space efficiency and ease of handling.

No. of Terminals: 30

Having 30 terminals allows for multiple connections and functionalities, making this product versatile in its applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environments and conditions.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures this product can be used in both extreme cold and hot conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and corrosion resistance, resulting in reliable connections and durability.

Width: 2.5 mm

The compact width allows for space-saving designs and integration into smaller electronic devices.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage enables energy-efficient operation and compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time ensures quick and efficient soldering processes, increasing production efficiency.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance makes this product suitable for rugged industrial applications with high reliability and durability requirements.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting and compact circuit designs, ideal for space-constrained applications.

Maximum Supply Voltage (Vsup): 3.6 V

With a high maximum supply voltage, this product can handle higher power requirements and variations in input voltage.

Technical Specifications

Other Function Consumer ICs NB7NPQ1002MMTTWG attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-XQCC-N30

JESD-609 Code:

e3

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.5 mm

Trade Compliance

NB7NPQ1002MMTTWG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 6