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NB2308AI2D

Onsemi

NB2308AI2D by Onsemi

NB2308AI2D Clock Driver by Onsemi operates at 3.3V, with 16 terminals and a max I (ol) of 8A. It features a small outline package style for industrial applications, offering 8 true outputs at a min frequency of 133.3MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,764 parts In-Stock

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Digiode

USA . 1,652 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 346 parts In-Stock

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$17.220

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346

$17.220

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$39.346

100+ parts

$35.805

1k+ parts

$32.264

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2,500

$39.346

$35.805

$32.264

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SupplyDigital Components

Austria . 7,639 parts In-Stock

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Kulean Microsystems

USA . 5,728 parts In-Stock

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Problanco Electronics

Mexico . 3,643 parts In-Stock

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Corphita

USA . 2,411 parts In-Stock

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TANS Electronics

Latvia . 1,460 parts In-Stock

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Corohmni

South Africa . 488 parts In-Stock

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Microchip USA

USA . 355 parts In-Stock

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UHIMA Technologies

Türkiye . 260 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the NB2308AI2D clock driver by Onsemi. Manufactured with top-quality materials and cutting-edge technology, this product offers superior output characteristics and a wide range of applications in the clock drivers & buffers category. With a nominal supply voltage of 3.3V and 8 true outputs, this small outline package ensures optimal performance and reliability. Upgrade your systems today and experience the benefits of seamless operation and precision timing with the NB2308AI2D.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan.

Surface Mount: YES

Easily integrated into circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard 3.3V power supplies, making it easy to incorporate into existing systems.

Maximum Operating Temperature: 85 °C

Can operate in a wide range of temperature environments, suitable for industrial applications.

Output Characteristics: 3-STATE

Ability to drive outputs to a high impedance state, providing flexibility in the system design.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature conditions, ideal for a variety of environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, improving overall performance.

Technical Specifications

Clock Drivers & Buffers NB2308AI2D attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2308

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.4 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Minimum fmax:

133.3 MHz

Trade Compliance

NB2308AI2D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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