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MTW32N20EG

Onsemi

MTW32N20EG by Onsemi

The Onsemi MTW32N20EG is a N-CHANNEL Power FET with 200V DS Breakdown Voltage, ideal for SWITCHING applications. It features 128A IDM, 810mJ EAS, and 0.075 ohm RDS(ON). Operating in ENHANCEMENT MODE, it has a max power dissipation of 180W and can withstand temperatures from -55 to 150 °C.

Median Price

$59.170

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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American Microsemiconductor Inc.

USA . 8 parts In-Stock

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Vyrian

USA . 7,953 parts In-Stock

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Digiode

USA . 1,725 parts In-Stock

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AZTECH Wire

Italy . 376 parts In-Stock

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$13.290

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Corohmni

South Africa . 156 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,746 parts In-Stock

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TANS Electronics

Latvia . 6,400 parts In-Stock

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Problanco Electronics

Mexico . 2,539 parts In-Stock

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SupplyDigital Components

Austria . 2,199 parts In-Stock

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Corphita

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Kulean Microsystems

USA . 1,248 parts In-Stock

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UHIMA Technologies

Türkiye . 904 parts In-Stock

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Overview

Elevate your power management capabilities with the MTW32N20EG by Onsemi, a high-quality N-CHANNEL Power Field Effect Transistor (FET) designed for switching applications. With a maximum drain current of 32A and a minimum breakdown voltage of 200V, this transistor offers exceptional performance and reliability. Its single configuration with built-in diode provides added convenience, making it ideal for a wide range of applications. Trust in Onsemi's expertise and invest in the MTW32N20EG for superior power control and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides good insulation properties and can help reduce the overall weight of the product.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are commonly used for high power applications as they provide lower ON resistance and higher efficiency compared to P-Channel FETs.

Minimum DS Breakdown Voltage: 200 V

With a minimum breakdown voltage of 200V, this FET can handle higher voltages and is suitable for various power switching applications.

Maximum Power Dissipation (Abs): 180 W

The high maximum power dissipation rating of 180W ensures that the FET can handle high power levels without overheating, making it a reliable choice for demanding applications.

Maximum Drain-Source On Resistance: 0.075 ohm

The low ON resistance of 0.075 ohm helps in reducing power losses and improving efficiency in power switching applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C allows the FET to operate reliably in high temperature environments without any performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) MTW32N20EG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

810 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

32 A

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AE

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

128 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTW32N20EG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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