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MMBZ5263ELT1

Onsemi

MMBZ5263ELT1 by Onsemi

MMBZ5263ELT1 by Onsemi is a Zener diode with 56V nominal reference voltage, 5% max voltage tolerance, and 150 ohm max dynamic impedance. It is used in applications requiring precise voltage regulation such as power supplies and voltage references due to its small outline package style and unidirectional polarity.

Median Price

$0.030

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20,895 parts In-Stock

1+ parts

-

100+ parts

$0.030

1k+ parts

$0.025

10k+ parts

$0.023

20,895

-

$0.030

$0.025

$0.023

Verical

USA . 20,895 parts In-Stock

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-

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20,895

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Distributors (In-Stock)

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Digiode

USA . 1,221 parts In-Stock

1+ parts

$0.024

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1,221

$0.024

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Vyrian

USA . 2,217 parts In-Stock

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2,217

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Distributors (Availability)

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$0.017

100+ parts

$0.015

1k+ parts

$0.014

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-

500

$0.017

$0.015

$0.014

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Corphita

USA . 1,981 parts In-Stock

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$0.022

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1,981

$0.022

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Corohmni

South Africa . 138 parts In-Stock

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$0.025

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138

$0.025

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AZTECH Wire

Italy . 1,080 parts In-Stock

1+ parts

$9.850

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1,080

$9.850

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Continental Prestige Electronics

USA . 20,895 parts In-Stock

1+ parts

-

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$0.021

20,895

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$0.021

SupplyDigital Components

Austria . 7,745 parts In-Stock

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TANS Electronics

Latvia . 7,234 parts In-Stock

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7,234

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Problanco Electronics

Mexico . 2,800 parts In-Stock

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2,800

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Kulean Microsystems

USA . 2,344 parts In-Stock

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UHIMA Technologies

Türkiye . 588 parts In-Stock

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588

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Overview

Unlock new possibilities with the MMBZ5263ELT1 by Onsemi, a top-tier manufacturer known for delivering high-quality electronic components. As a Zener diode, this product offers reliable voltage regulation and protection in various applications. Its small outline package makes it ideal for compact designs, while its unidirectional polarity ensures accurate performance. Trust Onsemi to provide innovative solutions that exceed expectations. Elevate your projects with the MMBZ5263ELT1 and experience enhanced efficiency and precision like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the diode, making it suitable for various applications.

Working Test Current: 2.2 mA

The low working test current of 2.2 mA allows for efficient power consumption and reliable performance.

Surface Mount: YES

Being surface mountable, this zener diode offers easy installation and saves space on the circuit board.

Nominal Reference Voltage: 56 V

The nominal reference voltage of 56 V makes this zener diode ideal for applications requiring a stable voltage reference.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this zener diode can withstand high temperature environments.

Technical Specifications

Zener Diodes MMBZ5263ELT1 attributes and parameters. Explore more Zener Diodes devices from Onsemi

Specs

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Dynamic Impedance:

150 ohm

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

.225 W

Qualification:

Not Qualified

Nominal Reference Voltage:

56 V

Sub-Category:

Voltage Reference Diodes

Surface Mount:

YES

Technology:

ZENER

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

Maximum Voltage Tolerance:

5 %

Working Test Current:

2.2 mA

Trade Compliance

MMBZ5263ELT1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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