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MC74VHC541MEL

Onsemi

MC74VHC541MEL by Onsemi

MC74VHC541MEL by Onsemi is an 8-bit bus driver with 3-STATE output. It operates at a supply voltage of 2-5.5V, has a propagation delay of 12ns, and can handle a load capacitance of 50pF. Ideal for industrial applications requiring true output polarity control in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,925 parts In-Stock

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Digiode

USA . 1,848 parts In-Stock

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AZTECH Wire

Italy . 1,181 parts In-Stock

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Problanco Electronics

Mexico . 5,976 parts In-Stock

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TANS Electronics

Latvia . 3,810 parts In-Stock

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SupplyDigital Components

Austria . 3,603 parts In-Stock

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Kulean Microsystems

USA . 2,473 parts In-Stock

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Corphita

USA . 1,755 parts In-Stock

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UHIMA Technologies

Türkiye . 679 parts In-Stock

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Corohmni

South Africa . 442 parts In-Stock

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Microchip USA

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Overview

Enhance your electronic designs with the MC74VHC541MEL by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in every product. This bus driver & transceiver is perfect for a wide range of applications, offering fast propagation delay and efficient power consumption. With its 3-STATE output characteristics and true output polarity, this compact and versatile component provides exceptional value and benefits to customers seeking high-performance solutions for their projects. Elevate your designs with the MC74VHC541MEL and experience the difference that Onsemi can make in your electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and lightweight design, making the product suitable for use in various environments.

Propagation Delay At Nominal Supply: 8 ns

Low propagation delay ensures fast and efficient communication within the bus driver and transceivers, resulting in smooth data transmission.

Surface Mount: YES

Surface mount capability enables easy installation and integration of the product onto circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Stable supply voltage of 3.3V ensures consistent performance of the bus driver and transceivers, reducing the risk of malfunctions.

No. of Bits: 8

8-bit configuration provides sufficient data transmission capacity for most applications, making the product versatile and suitable for various uses.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C allows the product to withstand elevated temperatures, ensuring reliable performance in challenging conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C enables the product to function in cold environments, increasing its usability across different temperature ranges.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers MC74VHC541MEL attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74VHC541MEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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