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MC74VHC1G125DF2G

Onsemi

MC74VHC1G125DF2G by Onsemi

MC74VHC1G125DF2G by Onsemi is a 3.3V bus driver with 16ns propagation delay, operating b/w -55 to 125 °C. It features a small outline package and dual terminals, suitable for military-grade applications requiring true output polarity control.

Median Price

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2

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1k+

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Vyrian

USA . 6,428 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 713 parts In-Stock

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$16.360

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$31.161

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$28.357

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$25.552

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TANS Electronics

Latvia . 4,057 parts In-Stock

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SupplyDigital Components

Austria . 3,516 parts In-Stock

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Problanco Electronics

Mexico . 3,352 parts In-Stock

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Kulean Microsystems

USA . 2,498 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 590 parts In-Stock

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Corohmni

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Microchip USA

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Overview

Enhance your electronic projects with the MC74VHC1G125DF2G from Onsemi, a top-tier manufacturer known for quality and reliability. This compact bus driver/transceiver offers fast propagation delays and true output polarity, making it ideal for a wide range of applications. With a small outline and dual terminal position, this device is perfect for space-constrained designs. Experience the benefits of Onsemi's cutting-edge technology and bring efficiency and precision to your projects with the MC74VHC1G125DF2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Works efficiently at a common supply voltage of 3.3V, suitable for many electronic systems.

Propagation Delay (tpd): 16 ns

Ensures fast signal transmission, enabling quick response times in bus communication.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for use in various environmental conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and reliable operation in bus driver applications.

Technical Specifications

Bus Driver & Transceivers MC74VHC1G125DF2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

MC74VHC1G125DF2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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