Loading...

MC74LVXT4066DTR2

Onsemi

MC74LVXT4066DTR2 by Onsemi

MC74LVXT4066DTR2 by Onsemi is a 4-function SPST multiplexer with 3.3V supplies, 50 ohm Ron, and -55 to 125 °C operating temp. Ideal for military-grade applications requiring separate outputs, it features a small outline package with 0.65mm pitch and offers 37dB isolation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,878 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,878

-

-

-

-

Digiode

USA . 561 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

561

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 897 parts In-Stock

1+ parts

$21.820

100+ parts

-

1k+ parts

-

10k+ parts

-

897

$21.820

-

-

-

Component Stockers USA

USA . 440 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

440

$99.990

-

-

-

Problanco Electronics

Mexico . 7,972 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,972

-

-

-

-

SupplyDigital Components

Austria . 4,266 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,266

-

-

-

-

Kulean Microsystems

USA . 2,652 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,652

-

-

-

-

Corphita

USA . 1,553 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,553

-

-

-

-

UHIMA Technologies

Türkiye . 861 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

861

-

-

-

-

TANS Electronics

Latvia . 406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

406

-

-

-

-

Microchip USA

USA . 148 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

148

-

-

-

-

Corohmni

South Africa . 141 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

141

-

-

-

-

Overview

Unlock the power of seamless connectivity with the MC74LVXT4066DTR2 by Onsemi. Crafted with precision and expertise, this multiplexer and switch device offers unmatched reliability and performance in a compact package. Ideal for a wide range of applications, this product delivers unparalleled value, efficiency, and versatility to customers. Elevate your projects to new heights with the quality and innovation that only Onsemi can provide. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the multiplexer, ensuring long-lasting performance.

No. of Functions: 4

Having 4 functions in one device allows for versatile and efficient use in various applications.

Nominal Supply Voltage (Vsup): 3 V

Operating at 3V nominal supply voltage makes this multiplexer energy efficient and suitable for low power applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this multiplexer can withstand harsh environmental conditions and maintain stable performance.

Technology: CMOS

CMOS technology ensures low power consumption, high speed operation, and compatibility with a wide range of digital systems.

Technical Specifications

Multiplexers & Switches MC74LVXT4066DTR2 attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Additional Features:

CONFIGURABLE AS 4-CHANNEL SINGLE ENDED MUX/DEMUX

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

14

Nominal Off-state Isolation:

37 dB

Nominal On-state Resistance Match:

25 ohm

Maximum On-state Resistance (Ron):

50 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

35 ns

Maximum Switch-on Time:

25 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

MC74LVXT4066DTR2 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20