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MC74LVX574DTG

Onsemi

MC74LVX574DTG by Onsemi

MC74LVX574DTG by Onsemi is an 8-bit bus driver with a supply voltage of 2.7V to 3.6V, featuring a propagation delay of 21ns and output current of 4A. It is ideal for industrial applications requiring high-speed data transmission in compact spaces due to its small outline package and true output polarity.

Median Price

$0.315

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 37,355 parts In-Stock

1+ parts

-

100+ parts

$0.315

1k+ parts

$0.262

10k+ parts

$0.233

37,355

-

$0.315

$0.262

$0.233

DigiKey

USA . 37,355 parts In-Stock

1+ parts

-

100+ parts

-

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$0.500

10k+ parts

-

37,355

-

-

$0.500

-

Verical

USA . 17,555 parts In-Stock

1+ parts

-

100+ parts

-

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$0.291

17,555

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-

-

$0.291

Flip Electronics (Authorized)

USA . 531 parts In-Stock

1+ parts

-

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-

1k+ parts

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531

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Distributors (In-Stock)

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Digiode

USA . 79 parts In-Stock

1+ parts

$0.314

100+ parts

-

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79

$0.314

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DigiKey Marketplace

USA . 37,355 parts In-Stock

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37,355

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Vyrian

USA . 5,640 parts In-Stock

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5,640

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Flip Electronics

USA . 531 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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531

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 194 parts In-Stock

1+ parts

$0.297

100+ parts

-

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-

194

$0.297

-

-

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Corohmni

South Africa . 347 parts In-Stock

1+ parts

$0.318

100+ parts

-

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347

$0.318

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AZTECH Wire

Italy . 1,034 parts In-Stock

1+ parts

$13.530

100+ parts

-

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1,034

$13.530

-

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Continental Prestige Electronics

USA . 37,355 parts In-Stock

1+ parts

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100+ parts

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$0.285

10k+ parts

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37,355

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$0.285

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TANS Electronics

Latvia . 5,965 parts In-Stock

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5,965

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SupplyDigital Components

Austria . 4,727 parts In-Stock

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4,727

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Kulean Microsystems

USA . 3,493 parts In-Stock

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3,493

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Perfect Parts

USA . 2,016 parts In-Stock

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2,016

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UHIMA Technologies

Türkiye . 517 parts In-Stock

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517

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Problanco Electronics

Mexico . 247 parts In-Stock

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247

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Overview

Discover the Onsemi MC74LVX574DTG, a high-quality bus driver & transceiver designed to deliver reliable performance in various industrial applications. With a robust construction and advanced technology, Onsemi ensures that this product meets the highest standards for efficiency and durability. Whether you need to drive data buses or connect multiple devices, the MC74LVX574DTG offers exceptional value by providing fast propagation delay, low power consumption, and versatile 3-state output characteristics. Trust Onsemi for superior quality and innovation in electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product resistant to wear and tear while maintaining portability.

Surface Mount: YES

Surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 2.7

Low nominal supply voltage helps in optimizing power consumption, making the product energy-efficient.

Maximum Operating Temperature: 85 °C

High operating temperature range allows for reliable performance even in harsh environmental conditions.

Propagation Delay (tpd): 21 ns

Low propagation delay ensures fast signal transmission, enhancing the overall efficiency of the product.

Maximum Frequency At Nominal Supply: 45000000 Hz

High maximum frequency at nominal supply voltage enables the product to handle high-speed data transmission requirements effectively.

Technical Specifications

Bus Driver & Transceivers MC74LVX574DTG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

45000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

21 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

MC74LVX574DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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