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MC74HC574ADTR2

Onsemi

MC74HC574ADTR2 by Onsemi

MC74HC574ADTR2 by Onsemi is an 8-bit bus driver with 3-STATE output. It operates at a supply voltage of 2-6V, with a propagation delay of 240ns. Ideal for applications requiring fast data transmission in compact spaces due to its small outline package and thin profile design.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 7,551 parts In-Stock

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ComSIT Distribution GmbH

Germany . 516 parts In-Stock

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Digiode

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Cyclops Electronics Ltd

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AZTECH Wire

Italy . 742 parts In-Stock

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$18.850

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QUARKTWIN TECHNOLOGY LTD

USA . 16,514 parts In-Stock

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SupplyDigital Components

Austria . 7,625 parts In-Stock

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Metaverse IC Inc.

Canada . 7,391 parts In-Stock

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Problanco Electronics

Mexico . 6,397 parts In-Stock

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Kulean Microsystems

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Assy Fe

Spain . 2,320 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,213 parts In-Stock

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Corphita

USA . 1,785 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 1,157 parts In-Stock

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UHIMA Technologies

Türkiye . 923 parts In-Stock

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TANS Electronics

Latvia . 426 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 122 parts In-Stock

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Overview

Enhance your electronic projects with the MC74HC574ADTR2 by Onsemi, a top-tier manufacturer known for delivering high-quality products. As a leading Bus Driver & Transceivers component, this device offers unparalleled performance and reliability. With its 8-bit configuration and 3-STATE output characteristics, it provides seamless data transmission at a maximum frequency of 20MHz. Ideal for military-grade applications, this product is designed to operate in extreme temperature conditions, ensuring durability and longevity. Invest in the MC74HC574ADTR2 today and experience the value and benefits that Onsemi brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transceiver, ensuring a longer lifespan.

Surface Mount: YES

Enables easy installation and integration into electronic circuit boards, reducing assembly time and cost.

No. of Bits: 8

Offers a sufficient amount of data transmission capability for a bus driver application.

Nominal Supply Voltage / Vsup (V): 3

Operates at a common voltage level, making it compatible with various electronic systems.

Maximum Frequency At Nominal Supply: 20000000 Hz

Supports high-speed data transmission, suitable for use in bus driver applications that require quick response times.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers MC74HC574ADTR2 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

MC74HC574ADTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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