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MC74HC541ANG

Onsemi

MC74HC541ANG by Onsemi

MC74HC541ANG by Onsemi is an 8-bit bus driver with a propagation delay of 28ns at 3V. It features 3-STATE output characteristics and operates in a temperature range from -55 to 125°C. Ideal for applications requiring true output polarity control, such as military-grade systems.

Median Price

$0.608

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 390 parts In-Stock

1+ parts

-

100+ parts

$0.608

1k+ parts

$0.504

10k+ parts

$0.450

390

-

$0.608

$0.504

$0.450

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 513 parts In-Stock

1+ parts

$0.473

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-

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513

$0.473

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Nova Conductors

Japan . 20 parts In-Stock

1+ parts

$0.549

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20

$0.549

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Vyrian

USA . 8,349 parts In-Stock

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8,349

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J2 Sourcing AB

Sweden . 270 parts In-Stock

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270

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Euro-Tech

UK . 196 parts In-Stock

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196

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Distributors (Availability)

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Semicontronic

India . 390 parts In-Stock

1+ parts

$0.423

100+ parts

$0.412

1k+ parts

$0.410

10k+ parts

-

390

$0.423

$0.412

$0.410

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Ampacity Inc.

Singapore . 216 parts In-Stock

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$0.423

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216

$0.423

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Corphita

USA . 400 parts In-Stock

1+ parts

$0.448

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400

$0.448

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Corohmni

South Africa . 356 parts In-Stock

1+ parts

$0.498

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356

$0.498

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Argo Parts USA

USA . 4,663 parts In-Stock

1+ parts

$0.549

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$0.533

4,663

$0.549

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$0.533

Continental Prestige Electronics

USA . 3,680 parts In-Stock

1+ parts

$0.549

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-

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$0.539

3,680

$0.549

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$0.539

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.549

100+ parts

$0.539

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500

$0.549

$0.539

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AZTECH Wire

Italy . 576 parts In-Stock

1+ parts

$9.906

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576

$9.906

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Component Stockers USA

USA . 408 parts In-Stock

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$99.990

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408

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 13,352 parts In-Stock

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TANS Electronics

Latvia . 7,744 parts In-Stock

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Microchip USA

USA . 5,395 parts In-Stock

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Problanco Electronics

Mexico . 3,505 parts In-Stock

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SupplyDigital Components

Austria . 2,523 parts In-Stock

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Kulean Microsystems

USA . 1,984 parts In-Stock

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1,984

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Metaverse IC Inc.

Canada . 1,500 parts In-Stock

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Kepictronics

USA . 475 parts In-Stock

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475

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UHIMA Technologies

Türkiye . 369 parts In-Stock

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369

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Overview

Unleash the power of seamless connectivity with the MC74HC541ANG by Onsemi. Crafted with precision and expertise, this bus driver & transceiver offers unrivaled quality and reliability. Perfect for a wide range of applications, it ensures smooth data transmission and efficient communication. Elevate your projects with the value and benefits that this product brings, providing you with a competitive edge in the market. Trust Onsemi for cutting-edge solutions that deliver exceptional performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable casing for the bus driver and transceivers, ensuring long-term reliability and ease of handling.

Propagation Delay At Nominal Supply: 28 ns

Low propagation delay allows for fast data transmission, making this product ideal for high-speed communication systems.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard voltage level of 3V, making it compatible with a wide range of electronic devices.

No. of Terminals: 20

Offers sufficient connectivity options for interfacing with other components in a bus system, ensuring versatile integration.

Minimum Operating Temperature: -55 °C

Can function reliably in extreme cold conditions, making it suitable for use in various environments.

Output Characteristics: 3-STATE

Supports three output states (high, low, and high-impedance), providing flexibility in controlling signal outputs and reducing interference.

Technical Specifications

Bus Driver & Transceivers MC74HC541ANG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.415 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

28 ns

Propagation Delay (tpd):

165 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.62 mm

Trade Compliance

MC74HC541ANG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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