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MC74HC4066AFELG

Onsemi

MC74HC4066AFELG by Onsemi

MC74HC4066AFELG by Onsemi is a CMOS SPST switch with 4 functions, 120 ohm Ron, and 45 ns switch-on time. It operates at -55 to 125 °C and has a MILITARY grade. Ideal for applications requiring separate output switching in compact designs.

Median Price

$0.282

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 11,821 parts In-Stock

1+ parts

-

100+ parts

$0.277

1k+ parts

$0.230

10k+ parts

$0.205

11,821

-

$0.277

$0.230

$0.205

Verical

USA . 4,717 parts In-Stock

1+ parts

-

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-

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-

10k+ parts

$0.288

4,717

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-

-

$0.288

Distributors (In-Stock)

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Digiode

USA . 272 parts In-Stock

1+ parts

$0.217

100+ parts

-

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272

$0.217

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Vyrian

USA . 2,903 parts In-Stock

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2,903

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Distributors (Availability)

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Corphita

USA . 289 parts In-Stock

1+ parts

$0.205

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-

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289

$0.205

-

-

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Corohmni

South Africa . 461 parts In-Stock

1+ parts

$0.228

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461

$0.228

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-

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Ampacity Inc.

Singapore . 9,320 parts In-Stock

1+ parts

$0.422

100+ parts

-

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9,320

$0.422

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AZTECH Wire

Italy . 178 parts In-Stock

1+ parts

$20.050

100+ parts

-

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178

$20.050

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Continental Prestige Electronics

USA . 11,821 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.199

10k+ parts

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11,821

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-

$0.199

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TANS Electronics

Latvia . 5,157 parts In-Stock

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5,157

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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SupplyDigital Components

Austria . 3,378 parts In-Stock

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3,378

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Perfect Parts

USA . 2,240 parts In-Stock

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2,240

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Problanco Electronics

Mexico . 1,918 parts In-Stock

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1,918

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Assy Fe

Spain . 1,781 parts In-Stock

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1,781

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UHIMA Technologies

Türkiye . 903 parts In-Stock

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903

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Kulean Microsystems

USA . 500 parts In-Stock

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500

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Microchip USA

USA . 427 parts In-Stock

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427

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Overview

Unlock the power of seamless connectivity with the MC74HC4066AFELG from Onsemi. This cutting-edge multiplexer and switch offers unparalleled quality and reliability, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications, this versatile device provides customers with unmatched value, efficiency, and convenience. Experience the benefits of effortless operation and enhanced performance with the MC74HC4066AFELG - the perfect solution for all your switching needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material makes the package durable and suitable for a variety of environments.

No. of Functions: 4

Having 4 functions allows for greater flexibility and versatility in applications.

Nominal Supply Voltage (Vsup): 3 V

Operates at a standard voltage of 3V, making it compatible with a wide range of systems.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, suitable for demanding industrial environments.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it efficient and reliable.

Technical Specifications

Multiplexers & Switches MC74HC4066AFELG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

3

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

14

Nominal Off-state Isolation:

40 dB

Nominal On-state Resistance Match:

20 ohm

Maximum On-state Resistance (Ron):

120 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/12

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

60 ns

Maximum Switch-on Time:

45 ns

Switching (V):

MAKE-BEFORE-BREAK

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.275 mm

Trade Compliance

MC74HC4066AFELG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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