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MC74HC4053ANG

Onsemi

MC74HC4053ANG by Onsemi

MC74HC4053ANG by Onsemi is a 16-terminal CMOS multiplexer with 3 functions. It operates at -55 to 125 °C, with Vsup ranging from 2-6V. Ideal for military-grade applications due to its low on-state resistance of 80 ohm and fast switch-on time of 245 ns.

Median Price

$0.437

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 300 parts In-Stock

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-

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$0.437

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$0.363

10k+ parts

$0.324

300

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$0.437

$0.363

$0.324

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Nova Conductors

Japan . 50 parts In-Stock

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$0.331

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$0.331

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Digiode

USA . 1,984 parts In-Stock

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$0.341

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Vyrian

USA . 4,083 parts In-Stock

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North Shore Components

USA . 178 parts In-Stock

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ABC Electronics Ltd.

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Elcom Components

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Distributors (Availability)

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Corphita

USA . 247 parts In-Stock

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$0.323

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Corohmni

South Africa . 360 parts In-Stock

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$0.324

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$0.324

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Ampacity Inc.

Singapore . 300 parts In-Stock

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$0.660

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$0.660

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AZTECH Wire

Italy . 762 parts In-Stock

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$14.239

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TANS Electronics

Latvia . 7,177 parts In-Stock

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SupplyDigital Components

Austria . 5,283 parts In-Stock

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Kulean Microsystems

USA . 3,540 parts In-Stock

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Problanco Electronics

Mexico . 3,224 parts In-Stock

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Continental Prestige Electronics

USA . 604 parts In-Stock

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Microchip USA

USA . 375 parts In-Stock

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UHIMA Technologies

Türkiye . 68 parts In-Stock

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Perfect Parts

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Overview

Unlock endless possibilities with the MC74HC4053ANG by Onsemi. This high-quality multiplexer & switch offers unparalleled performance and reliability, backed by the reputable manufacturer Onsemi. Perfect for a wide range of applications, this versatile product provides customers with value, benefits, and advantages that will elevate their projects to new heights. Upgrade your electronic systems today with the MC74HC4053ANG and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the multiplexer, ensuring long-term reliability.

No. of Functions: 3

Having multiple functions in one device allows for more versatile applications and can save space in a circuit design.

Nominal Supply Voltage (Vsup): 4.5 V

This voltage is commonly used in many electronic applications, making it easy to integrate this multiplexer into existing systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this multiplexer can perform reliably even in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this multiplexer efficient and reliable.

Technical Specifications

Multiplexers & Switches MC74HC4053ANG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Maximum Negative Supply Voltage (Vsup):

-6 V

Minimum Negative Supply Voltage (Vsup):

0 V

Nominal Negative Supply Voltage (Vsup):

-4.5 V

No. of Channels:

2

No. of Functions:

3

No. of Terminals:

16

Nominal Off-state Isolation:

50 dB

Nominal On-state Resistance Match:

12 ohm

Maximum On-state Resistance (Ron):

80 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6,GND/-6

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.08 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Maximum Switch-off Time:

160 ns

Maximum Switch-on Time:

245 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7.62 mm

Trade Compliance

MC74HC4053ANG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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