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MC74HC273AFG

Onsemi

MC74HC273AFG by Onsemi

MC74HC273AFG by Onsemi is an 8-bit latch with 3V nominal voltage, 220ns propagation delay, and 6A max I (ol). It is a CMOS technology component suitable for military-grade applications requiring positive edge trigger type and true output polarity.

Median Price

$0.512

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,902 parts In-Stock

1+ parts

-

100+ parts

$0.502

1k+ parts

$0.417

10k+ parts

$0.371

6,902

-

$0.502

$0.417

$0.371

Verical

USA . 5,912 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.521

10k+ parts

$0.464

5,912

-

-

$0.521

$0.464

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 688 parts In-Stock

1+ parts

$0.391

100+ parts

-

1k+ parts

-

10k+ parts

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688

$0.391

-

-

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Vyrian

USA . 4,420 parts In-Stock

1+ parts

-

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4,420

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R&J Components

USA . 1,383 parts In-Stock

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-

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1,383

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,110 parts In-Stock

1+ parts

$0.371

100+ parts

-

1k+ parts

-

10k+ parts

-

1,110

$0.371

-

-

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Corohmni

South Africa . 419 parts In-Stock

1+ parts

$0.393

100+ parts

-

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419

$0.393

-

-

-

AZTECH Wire

Italy . 747 parts In-Stock

1+ parts

$17.320

100+ parts

-

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10k+ parts

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747

$17.320

-

-

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$26.918

100+ parts

$24.495

1k+ parts

$22.073

10k+ parts

-

3,000

$26.918

$24.495

$22.073

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Kulean Microsystems

USA . 8,309 parts In-Stock

1+ parts

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8,309

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Continental Prestige Electronics

USA . 6,902 parts In-Stock

1+ parts

-

100+ parts

$0.350

1k+ parts

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10k+ parts

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6,902

-

$0.350

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Problanco Electronics

Mexico . 5,692 parts In-Stock

1+ parts

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5,692

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TANS Electronics

Latvia . 5,119 parts In-Stock

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5,119

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SupplyDigital Components

Austria . 1,679 parts In-Stock

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1,679

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Microchip USA

USA . 477 parts In-Stock

1+ parts

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100+ parts

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477

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UHIMA Technologies

Türkiye . 417 parts In-Stock

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417

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Overview

Experience seamless operation and enhanced performance with the MC74HC273AFG from Onsemi, a trusted leader in electronic components. This high-quality latch & flip-flop device is designed for various applications, offering customers exceptional value and benefits. With reliable operation, efficient power consumption, and a wide operating temperature range, this product ensures optimal functionality in military-grade environments. Choose Onsemi for superior quality and unmatched performance in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to temperature changes, making the product long-lasting and reliable.

Surface Mount: YES

Surface mount technology allows for easy installation and integration into circuit boards, saving space and simplifying the manufacturing process.

No. of Bits: 8

The 8 bits provide ample functionality and versatility for digital data processing and storage.

Nominal Supply Voltage / Vsup (V): 3

The 3V supply voltage is common and easily sourced, ensuring compatibility with a wide range of systems and applications.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance helps maintain signal integrity and speed in data transmission.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, the product can withstand harsh environmental conditions and temperature fluctuations.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a variety of digital systems, making it a reliable choice for electronic applications.

Technical Specifications

Latches & Flip-Flops MC74HC273AFG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

220 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

5.275 mm

Minimum fmax:

24 MHz

Trade Compliance

MC74HC273AFG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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