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MC74HC273AFELG

Onsemi

MC74HC273AFELG by Onsemi

MC74HC273AFELG by Onsemi is an 8-bit latch with 3V nominal voltage, 220ns propagation delay, and 6A max I (ol). It is used in military-grade applications requiring positive edge trigger type and operates at a max frequency of 20MHz.

Median Price

$0.404

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,065 parts In-Stock

1+ parts

-

100+ parts

$0.396

1k+ parts

$0.329

10k+ parts

$0.293

1,065

-

$0.396

$0.329

$0.293

Verical

USA . 1,065 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.411

10k+ parts

$0.367

1,065

-

-

$0.411

$0.367

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,321 parts In-Stock

1+ parts

$0.309

100+ parts

-

1k+ parts

-

10k+ parts

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1,321

$0.309

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-

Vyrian

USA . 3,488 parts In-Stock

1+ parts

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3,488

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 845 parts In-Stock

1+ parts

$0.276

100+ parts

-

1k+ parts

-

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845

$0.276

-

-

-

Corphita

USA . 447 parts In-Stock

1+ parts

$0.292

100+ parts

-

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-

447

$0.292

-

-

-

Corohmni

South Africa . 342 parts In-Stock

1+ parts

$0.325

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342

$0.325

-

-

-

AZTECH Wire

Italy . 745 parts In-Stock

1+ parts

$13.030

100+ parts

-

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745

$13.030

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Kulean Microsystems

USA . 7,557 parts In-Stock

1+ parts

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7,557

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TANS Electronics

Latvia . 6,933 parts In-Stock

1+ parts

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6,933

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Problanco Electronics

Mexico . 6,555 parts In-Stock

1+ parts

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6,555

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SupplyDigital Components

Austria . 6,060 parts In-Stock

1+ parts

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6,060

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RC Electronics

USA . 5,400 parts In-Stock

1+ parts

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5,400

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Microchip USA

USA . 201 parts In-Stock

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201

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UHIMA Technologies

Türkiye . 85 parts In-Stock

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85

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Overview

Enhance your electronic projects with the MC74HC273AFELG by Onsemi, a top-tier manufacturer in the industry. This high-quality latches & flip-flops component offers customers reliability and efficiency in their designs. With a wide range of applications, this product provides value and benefits to users looking for optimal performance. Trust Onsemi for cutting-edge technology that delivers exceptional results in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Enables easy installation and saves space on the circuit board.

No. of Bits: 8

Provides a higher level of processing and storage capabilities.

Nominal Supply Voltage / Vsup (V): 3

Operates efficiently at a standard voltage level.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments, suitable for various applications.

Trigger Type: POSITIVE EDGE

Ensures accurate triggering for precise control and timing.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Latches & Flip-Flops MC74HC273AFELG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

220 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

5.275 mm

Minimum fmax:

24 MHz

Trade Compliance

MC74HC273AFELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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