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MC74HC245AFELG

Onsemi

MC74HC245AFELG by Onsemi

MC74HC245AFELG by Onsemi is an 8-bit bus driver with 22ns propagation delay at 3V. It features a small outline package, operates b/w -55 to 125°C, and has dual terminal position. Commonly used in bidirectional control applications requiring true output polarity.

Median Price

$0.404

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 157,532 parts In-Stock

1+ parts

-

100+ parts

$0.396

1k+ parts

$0.329

10k+ parts

$0.293

157,532

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$0.396

$0.329

$0.293

Verical

USA . 1,859 parts In-Stock

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$0.411

10k+ parts

$0.367

1,859

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$0.411

$0.367

Distributors (In-Stock)

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Digiode

USA . 980 parts In-Stock

1+ parts

$0.309

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980

$0.309

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Vyrian

USA . 7,278 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 999 parts In-Stock

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$0.292

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999

$0.292

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Corohmni

South Africa . 131 parts In-Stock

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$0.325

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131

$0.325

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Component Stockers USA

USA . 174,639 parts In-Stock

1+ parts

$0.330

100+ parts

$0.310

1k+ parts

$0.280

10k+ parts

$0.280

174,639

$0.330

$0.310

$0.280

$0.280

AZTECH Wire

Italy . 1,209 parts In-Stock

1+ parts

$9.630

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1,209

$9.630

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Continental Prestige Electronics

USA . 162,032 parts In-Stock

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$0.282

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162,032

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$0.282

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QUARKTWIN TECHNOLOGY LTD

USA . 29,607 parts In-Stock

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Kulean Microsystems

USA . 6,556 parts In-Stock

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SupplyDigital Components

Austria . 5,688 parts In-Stock

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Problanco Electronics

Mexico . 5,372 parts In-Stock

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TANS Electronics

Latvia . 5,164 parts In-Stock

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Perfect Parts

USA . 2,088 parts In-Stock

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Kepictronics

USA . 883 parts In-Stock

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UHIMA Technologies

Türkiye . 509 parts In-Stock

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Microchip USA

USA . 380 parts In-Stock

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Overview

Enhance your electronic design projects with the MC74HC245AFELG by Onsemi, a top-tier manufacturer known for quality and reliability. This bus driver and transceiver offers seamless integration and high-performance in a compact package, making it ideal for a variety of applications. With fast propagation delay and true output polarity, this component ensures efficient signal transmission and control. Trust Onsemi to deliver cutting-edge technology that brings value and benefits to your projects, setting you apart from the competition. Upgrade your designs today with the MC74HC245AFELG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Propagation Delay At Nominal Supply: 22 ns

Low propagation delay ensures efficient signal transmission and fast response times, making this product suitable for high-speed data transfer.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design, enabling efficient placement on circuit boards and maximizing space utilization.

No. of Bits: 8

Having 8 bits allows for versatile data processing and communication capabilities, making this product suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 3

Operating at a lower nominal supply voltage of 3V helps in reducing power consumption and energy costs, making it an energy-efficient choice.

Power Supplies (V): 2/6

Support for multiple power supply voltages (2V to 6V) allows for flexibility in system integration and compatibility with different power sources.

No. of Terminals: 20

With 20 terminals, this product offers ample connectivity options and interfaces for seamless integration with other components.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves board space and enables compact designs, ideal for applications where size constraints are a concern.

Maximum I (ol): 6 Amp

High maximum output current capacity of 6A ensures robust performance and reliability, making this product suitable for demanding operational conditions.

Propagation Delay (tpd): 110 ns

Though not the fastest, the propagation delay of 110 ns is still suitable for many applications that require reliable and efficient signal transmission.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh environmental conditions and industrial settings.

Output Characteristics: 3-STATE

3-STATE output characteristics provide flexibility in signal routing and connectivity, allowing for efficient management of data flow.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures reliable performance in extreme cold environments, making this product versatile and durable.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel, palladium, and gold provides excellent conductivity, corrosion resistance, and durability for long-term use.

Terminal Position: DUAL

Dual terminal positions allow for versatile mounting options and facilitate efficient connection with other components in the circuit.

No. of Ports: 2

With 2 ports, this product offers versatility in signal routing and connectivity, enabling seamless integration into various systems and applications.

Maximum Seated Height: 2.05 mm

The low maximum seated height of 2.05 mm ensures a compact form factor, ideal for applications where space constraints are a consideration.

Width: 5.275 mm

With a narrow width of 5.275 mm, this product is space-efficient and allows for dense packing on circuit boards, maximizing space utilization.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and compatibility with other components, making this product reliable and easy to integrate.

Minimum Supply Voltage (Vsup): 2 V

Support for a low minimum supply voltage of 2V enables operation in low-power scenarios and enhances energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures proper soldering and integration during manufacturing processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes, ensuring reliable assembly.

Length: 12.575 mm

The moderate length of 12.575 mm provides a balanced form factor, making this product suitable for various applications without sacrificing space efficiency.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure high reliability and durability in extreme environmental conditions, making this product ideal for rugged applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making this product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides secure mounting and connectivity, ensuring stable operation and ease of installation in various electronic systems.

Packing Method: RAIL

Rail packing method offers convenient handling, storage, and transportation of the product, ensuring safe delivery and installation in manufacturing processes.

Terminal Pitch: 1.27 mm

Narrow terminal pitch of 1.27 mm allows for high-density mounting on PCBs, enabling efficient use of space and enhancing connectivity options.

Count Direction: BIDIRECTIONAL

Bidirectional count direction offers flexibility in data transmission and reception, making this product versatile and suitable for various communication protocols.

Control Type: COMMON CONTROL

Common control feature allows for easy management and synchronization of multiple components, enhancing overall system performance and functionality.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, ensuring the product's reliability in moderate humidity environments and during reflow processes.

Maximum Supply Voltage (Vsup): 6 V

Support for a high maximum supply voltage of 6V offers compatibility with a wide range of power sources and ensures robust performance in various operating conditions.

Technical Specifications

Bus Driver & Transceivers MC74HC245AFELG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5.275 mm

Trade Compliance

MC74HC245AFELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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