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MC74HC245ADT

Onsemi

MC74HC245ADT by Onsemi

MC74HC245ADT by Onsemi is an 8-bit bus driver with a propagation delay of 22ns at 3V. It features a max I (ol) of 6A, operates in temperatures ranging from -55 to 125°C, and has a common control for bidirectional communication. Ideal for applications requiring fast signal transmission in compact spaces.

Median Price

$0.194

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 2,175 parts In-Stock

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$0.215

2,175

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$0.215

Rochester

USA . 1,775 parts In-Stock

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-

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$0.172

1k+ parts

$0.143

10k+ parts

$0.127

1,775

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$0.172

$0.143

$0.127

Distributors (In-Stock)

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Nova Conductors

Japan . 22 parts In-Stock

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$0.126

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Digiode

USA . 928 parts In-Stock

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$0.134

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DigiKey Marketplace

USA . 2,775 parts In-Stock

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Vyrian

USA . 1,919 parts In-Stock

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Legend Electronics Inc.

USA . 166 parts In-Stock

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LWI Electronics Inc

India . 25 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,604 parts In-Stock

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$0.120

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2,604

$0.120

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Argo Parts USA

USA . 574 parts In-Stock

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$0.126

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$0.122

574

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$0.122

Bastille Electronics

Australia . 330 parts In-Stock

1+ parts

$0.126

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$0.120

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$0.114

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$0.112

330

$0.126

$0.120

$0.114

$0.112

Corphita

USA . 1,697 parts In-Stock

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$0.127

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Corohmni

South Africa . 99 parts In-Stock

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$0.141

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Aztec Data Supply Inc.

USA . 89 parts In-Stock

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$17.230

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$17.230

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AZTECH Wire

Italy . 401 parts In-Stock

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$21.740

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Problanco Electronics

Mexico . 7,828 parts In-Stock

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SupplyDigital Components

Austria . 6,801 parts In-Stock

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Kulean Microsystems

USA . 5,444 parts In-Stock

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Microchip USA

USA . 4,815 parts In-Stock

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Andel Nordic

Denmark . 4,616 parts In-Stock

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Perfect Parts

USA . 3,147 parts In-Stock

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Continental Prestige Electronics

USA . 2,775 parts In-Stock

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TANS Electronics

Latvia . 2,021 parts In-Stock

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UHIMA Technologies

Türkiye . 749 parts In-Stock

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Overview

Enhance your electronic designs with the MC74HC245ADT by Onsemi, a top-notch bus driver & transceiver that delivers unmatched quality and reliability. Onsemi is a renowned manufacturer known for producing high-performance components, and this product is no exception. With a propagation delay of 22 ns and 3-state output characteristics, this device is perfect for a wide range of applications. Its small outline and thin profile make it ideal for space-constrained projects, while its true output polarity ensures seamless integration. Experience the value and benefits of this product firsthand and take your projects to the next level with the MC74HC245ADT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and resistance to physical damage, making the product suitable for harsh operating conditions.

Propagation Delay At Nominal Supply: 22 ns

Low propagation delay allows for fast signal processing, making the product ideal for high-speed communication applications.

Surface Mount: YES

Surface mount capability enables easy and efficient integration into electronic circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular shape provides a compact form factor, making the product suitable for applications where space is limited.

No. of Bits: 8

This product offers 8 bits of data transmission, providing sufficient bandwidth for a variety of communication protocols and data processing tasks.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V ensures compatibility with a wide range of electronic systems and power sources.

Power Supplies (V): 2/6

Support for multiple power supply voltages (2V to 6V) allows for flexible integration into diverse electronic systems.

No. of Terminals: 20

With 20 terminals, this product offers a sufficient number of connection points for easy interfacing with other components and systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch design save space on circuit boards and reduce overall system size.

Maximum I (ol): 6 Amp

Support for a maximum output current of 6A allows for driving high current loads, making the product versatile for a range of applications.

Propagation Delay (tpd): 110 ns

Although not the lowest, the propagation delay of 110 ns still ensures relatively fast signal transmission, suitable for many real-time applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the product to function reliably in challenging thermal environments.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance state, enabling multiple devices to share the same bus line without interference.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures reliable performance even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity, corrosion resistance, and durability for reliable electrical connections.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit board layout and allow for easy integration into various PCB designs.

No. of Ports: 2

Support for 2 ports enables versatile connectivity options for data transmission and reception in multiple directions.

Maximum Seated Height: 1.2 mm

The low seated height of 1.2 mm minimizes the overall height of the product when mounted on a circuit board, saving space in the system.

Width: 4.4 mm

The small width of 4.4 mm allows for compact placement on a PCB and efficient use of limited space in electronic devices.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and compatibility with systems requiring specific logic levels.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage of 2V allows for operation in low-power systems and extends the range of compatible power sources.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering during PCB assembly, resulting in reliable electrical connections.

Length: 6.5 mm

The compact length of 6.5 mm aids in space-saving design and allows for efficient placement on a circuit board.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable operation in harsh environmental conditions and aerospace applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical mounting and ease of soldering, ensuring stable electrical connections and assembly.

Packing Method: RAIL

Rail packing method facilitates automated assembly processes and protects the product during shipping and handling.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting on PCBs, optimizing space utilization and enabling compact designs.

Count Direction: BIDIRECTIONAL

Bidirectional count direction enables flexible data communication in both forward and reverse directions, enhancing system compatibility.

Control Type: COMMON CONTROL

Common control type simplifies system integration and operation by allowing centralized control over multiple functions using a single interface.

Maximum Supply Voltage (Vsup): 6 V

With a maximum supply voltage of 6V, the product can interface with a wide range of power sources and electronic systems, increasing its versatility.

Technical Specifications

Bus Driver & Transceivers MC74HC245ADT attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

4.4 mm

Trade Compliance

MC74HC245ADT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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