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MC74ACT540DTR2

Onsemi

MC74ACT540DTR2 by Onsemi

MC74ACT540DTR2 by Onsemi is an 8-bit bus driver with 3-STATE output, operating at a supply voltage of 5V. It features a max I (ol) of 24A and propagation delay of 8.5ns, suitable for industrial applications requiring inverted output polarity and dual terminal position. The package style is small outline with thin profile, making it ideal for compact designs in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,391 parts In-Stock

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Digiode

USA . 289 parts In-Stock

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AZTECH Wire

Italy . 53 parts In-Stock

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$14.490

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Component Stockers USA

USA . 495 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 8,661 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 6,167 parts In-Stock

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Microchip USA

USA . 5,787 parts In-Stock

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SupplyDigital Components

Austria . 4,759 parts In-Stock

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Problanco Electronics

Mexico . 4,466 parts In-Stock

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Kulean Microsystems

USA . 4,462 parts In-Stock

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Metaverse IC Inc.

Canada . 988 parts In-Stock

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TANS Electronics

Latvia . 949 parts In-Stock

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Corphita

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Corohmni

South Africa . 204 parts In-Stock

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UHIMA Technologies

Türkiye . 117 parts In-Stock

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Overview

Upgrade your electronic projects with the MC74ACT540DTR2 by Onsemi, a high-quality bus driver and transceiver that offers reliable performance and seamless integration. With Onsemi's reputation for excellence in manufacturing, this product ensures durability and efficiency in various applications. From industrial automation to consumer electronics, this versatile component provides value and benefits that cater to your specific needs. Trust Onsemi for cutting-edge technology and superior products that deliver unmatched results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product, making it ideal for rugged environments.

No. of Bits: 8

This product offers an 8-bit resolution, providing sufficient data transmission capabilities for various applications.

Propagation Delay (tpd): 8.5 ns

With a low propagation delay of 8.5 ns, this product enables fast data transmission, ensuring efficient performance.

Technology: CMOS

The use of CMOS technology results in low power consumption and high noise immunity, making the product energy efficient and reliable.

Technical Specifications

Bus Driver & Transceivers MC74ACT540DTR2 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

ACT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC74ACT540DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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