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MC74ACT273MG

Onsemi

MC74ACT273MG by Onsemi

MC74ACT273MG by Onsemi is an 8-bit latch with a 5V supply voltage, 12ns propagation delay, and 125MHz max frequency. It is used in industrial applications requiring positive edge triggering and true output polarity. The flip-flop comes in a small outline package with surface mount capability for compact designs.

Median Price

$0.317

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$0.317

1k+ parts

$0.263

10k+ parts

$0.235

1

-

$0.317

$0.263

$0.235

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 775 parts In-Stock

1+ parts

$0.247

100+ parts

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775

$0.247

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Vyrian

USA . 7,450 parts In-Stock

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7,450

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Distributors (Availability)

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Corphita

USA . 1,046 parts In-Stock

1+ parts

$0.234

100+ parts

-

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1,046

$0.234

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Corohmni

South Africa . 261 parts In-Stock

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$0.260

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261

$0.260

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AZTECH Wire

Italy . 1,015 parts In-Stock

1+ parts

$19.330

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1,015

$19.330

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Problanco Electronics

Mexico . 5,768 parts In-Stock

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5,768

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TANS Electronics

Latvia . 3,146 parts In-Stock

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Kulean Microsystems

USA . 2,391 parts In-Stock

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2,391

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SupplyDigital Components

Austria . 1,335 parts In-Stock

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1,335

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UHIMA Technologies

Türkiye . 898 parts In-Stock

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898

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Microchip USA

USA . 367 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the MC74ACT273MG by Onsemi, a leading manufacturer in the industry. This versatile latch & flip-flop is perfect for a wide range of applications, offering customers exceptional value and benefits. With a nominal supply voltage of 5V and a maximum operating temperature of 85 °C, this product ensures optimal performance and durability. Trust Onsemi to deliver superior products that meet your needs and exceed your expectations. Experience the difference with the MC74ACT273MG today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the latch or flip-flop, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, saving valuable space on the circuit board.

No. of Bits: 8

Having 8 bits allows for more complex operations and data processing in the latch or flip-flop, making it versatile for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes integration with other components straightforward and ensures compatibility in most circuit designs.

Propagation Delay (tpd): 12 ns

With a fast propagation delay, this latch or flip-flop can rapidly respond to input changes, enhancing overall performance in time-critical applications.

Maximum Operating Temperature: 85 °C

The wide temperature range allows for operation in various environmental conditions, making this product suitable for industrial settings.

Maximum Frequency At Nominal Supply: 125000000 Hz

The high maximum frequency capability ensures fast data processing and reliable performance in high-speed applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation of the latch or flip-flop.

Technical Specifications

Latches & Flip-Flops MC74ACT273MG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

125000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

5.275 mm

Minimum fmax:

125 MHz

Trade Compliance

MC74ACT273MG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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