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MC74AC541DWG

Onsemi

MC74AC541DWG by Onsemi

MC74AC541DWG by Onsemi is an 8-bit bus driver with 9ns propagation delay at 5V, suitable for industrial applications. It features a 3-STATE output, operates b/w -40 to 85°C, and supports dual terminal position. With a small outline package style and matte tin finish, it is ideal for surface mount designs requiring fast signal transmission.

Median Price

$0.610

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 178 parts In-Stock

1+ parts

$1.060

100+ parts

$0.648

1k+ parts

$0.526

10k+ parts

$0.466

178

$1.060

$0.648

$0.526

$0.466

DigiKey

USA . 65 parts In-Stock

1+ parts

$1.060

100+ parts

$0.663

1k+ parts

$0.545

10k+ parts

$0.495

65

$1.060

$0.663

$0.545

$0.495

Avnet

USA . 2,204 parts In-Stock

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2,204

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Arrow

USA . 2,014 parts In-Stock

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-

100+ parts

$0.489

1k+ parts

$0.425

10k+ parts

$0.391

2,014

-

$0.489

$0.425

$0.391

Verical

USA . 2,014 parts In-Stock

1+ parts

-

100+ parts

$0.489

1k+ parts

$0.425

10k+ parts

$0.391

2,014

-

$0.489

$0.425

$0.391

EBV Elektronik

Germany . 950 parts In-Stock

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950

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Rochester

USA . 28 parts In-Stock

1+ parts

-

100+ parts

$0.610

1k+ parts

$0.506

10k+ parts

$0.451

28

-

$0.610

$0.506

$0.451

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,489 parts In-Stock

1+ parts

$0.474

100+ parts

-

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2,489

$0.474

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.491

100+ parts

-

1k+ parts

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50

$0.491

-

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TME

Poland . 90 parts In-Stock

1+ parts

$1.280

100+ parts

$0.770

1k+ parts

-

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90

$1.280

$0.770

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Flip Electronics

USA . 69,198 parts In-Stock

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Vyrian

USA . 7,759 parts In-Stock

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7,759

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ACDS - Activité Composants Distribution Service

France . 1,102 parts In-Stock

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1,102

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NAC Semi

USA . 760 parts In-Stock

1+ parts

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$1.410

10k+ parts

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760

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$1.410

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Bristol Electronics

USA . 254 parts In-Stock

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254

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Atlantic Semiconductor

USA . 254 parts In-Stock

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254

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Dan-Mar Components

USA . 222 parts In-Stock

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222

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Classic Components Corporation

USA . 74 parts In-Stock

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74

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ComSIT Distribution GmbH

Germany . 38 parts In-Stock

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38

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Distributors (Availability)

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Ampacity Inc.

Singapore . 708 parts In-Stock

1+ parts

$0.322

100+ parts

-

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708

$0.322

-

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Corohmni

South Africa . 281 parts In-Stock

1+ parts

$0.379

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281

$0.379

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Component Stockers USA

USA . 995 parts In-Stock

1+ parts

$0.420

100+ parts

$0.620

1k+ parts

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995

$0.420

$0.620

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Corphita

USA . 782 parts In-Stock

1+ parts

$0.449

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782

$0.449

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Netroflash

USA . 100 parts In-Stock

1+ parts

$0.491

100+ parts

-

1k+ parts

$0.466

10k+ parts

$0.457

100

$0.491

-

$0.466

$0.457

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Perfect Parts

USA . 4,381 parts In-Stock

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TANS Electronics

Latvia . 2,934 parts In-Stock

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2,934

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Kepictronics

USA . 1,862 parts In-Stock

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1,862

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Problanco Electronics

Mexico . 610 parts In-Stock

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610

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UHIMA Technologies

Türkiye . 599 parts In-Stock

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599

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Eastek

USA . 380 parts In-Stock

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380

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SupplyDigital Components

Austria . 104 parts In-Stock

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Kulean Microsystems

USA . 66 parts In-Stock

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66

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Overview

Enhance your electronic projects with the reliable MC74AC541DWG bus driver & transceiver by Onsemi. Crafted with precision using high-quality materials, this product offers fast propagation delay and 3-state output characteristics for seamless data transmission. Perfect for industrial applications, this versatile component operates at a wide range of temperatures and voltages, providing consistent performance under any conditions. Trust Onsemi's expertise in semiconductor technology to deliver exceptional value and efficiency to your designs with the MC74AC541DWG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Propagation Delay At Nominal Supply: 9 ns

With a low propagation delay, this product ensures fast and efficient signal transmission, making it suitable for high-speed data communication.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB, making it a convenient choice for compact designs.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into existing systems and provides a standard form factor for compatibility with various applications.

No. of Bits: 8

With 8 bits, this product offers sufficient data processing capabilities, making it suitable for handling complex communication protocols and data formats.

Nominal Supply Voltage / Vsup: 5V

Operating at a standard 5V supply voltage, this product is compatible with a wide range of systems and can easily be integrated into existing setups.

Load Capacitance (CL): 50 pF

The low load capacitance ensures stable signal transmission and minimal signal distortion, making this product reliable for high-frequency applications.

Power Supplies (V): 3.3/5

Compatible with both 3.3V and 5V power supplies, this product offers flexibility in power options, allowing for versatile integration in different systems.

No. of Terminals: 20

With 20 terminals, this product provides sufficient connectivity options for interfacing with other components, making it versatile for various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for dense packing of components, making it an efficient choice for compact designs.

Technical Specifications

Bus Driver & Transceivers MC74AC541DWG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

MC74AC541DWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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