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MC34161PG

Onsemi

MC34161PG by Onsemi

MC34161PG by Onsemi is a Power Management IC with 8 terminals, operating at 5V. It has a max supply voltage of 40V and supports two channels. This IC is ideal for power supply support circuits in commercial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 10,310 parts In-Stock

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Vyrian

USA . 2,447 parts In-Stock

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Digiode

USA . 570 parts In-Stock

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570

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AZTECH Wire

Italy . 134 parts In-Stock

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$20.650

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134

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Problanco Electronics

Mexico . 7,986 parts In-Stock

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Microchip USA

USA . 5,722 parts In-Stock

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Lixinc

USA . 2,559 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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SupplyDigital Components

Austria . 1,716 parts In-Stock

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Corphita

USA . 1,669 parts In-Stock

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Kulean Microsystems

USA . 1,035 parts In-Stock

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UHIMA Technologies

Türkiye . 290 parts In-Stock

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Kepictronics

USA . 232 parts In-Stock

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Corohmni

South Africa . 58 parts In-Stock

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TANS Electronics

Latvia . 55 parts In-Stock

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Overview

Discover the power of reliable and efficient power management with the Onsemi MC34161PG. Manufactured by a trusted name in the industry, this Power Management IC offers unparalleled performance and quality. Ideal for a wide range of applications, this product provides customers with the value and benefits they need to succeed. Say goodbye to worries about power supplies with the MC34161PG - your solution for seamless and effective power management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides good durability and protection for the IC inside, making it suitable for various environmental conditions.

Nominal Supply Voltage (Vsup): 5 V

Operates at a commonly used supply voltage, making it compatible with many systems and devices.

No. of Terminals: 8

Sufficient number of terminals for connecting the IC to other components, allowing for versatile use in different circuit designs.

Maximum Operating Temperature: 70 °C

Capable of operating at relatively high temperatures without compromising performance, suitable for applications where heat dissipation is a concern.

Terminal Finish: Tin (Sn)

Tin terminal finish ensures good conductivity and solderability, making it easy to integrate the IC into circuit boards during manufacturing.

Technical Specifications

Power Management ICs MC34161PG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

MINIMUM SUPPLY NEEDED FOR NEGATIVE SENSING IS 4V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.78 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.7 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7.62 mm

Trade Compliance

MC34161PG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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