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MC34161DMR2

Onsemi

MC34161DMR2 by Onsemi

MC34161DMR2 by Onsemi is a Power Management IC with 8 terminals, operating at 0-70 °C. It supports a supply voltage range of 2-40V and has a max supply current of 0.9mA. Ideal for power supply support circuits in commercial-grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,141 parts In-Stock

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2,141

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Digiode

USA . 595 parts In-Stock

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595

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AZTECH Wire

Italy . 1,206 parts In-Stock

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$8.520

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TANS Electronics

Latvia . 8,286 parts In-Stock

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Kulean Microsystems

USA . 6,264 parts In-Stock

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SupplyDigital Components

Austria . 5,697 parts In-Stock

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Problanco Electronics

Mexico . 1,794 parts In-Stock

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Corphita

USA . 1,767 parts In-Stock

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Microchip USA

USA . 398 parts In-Stock

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UHIMA Technologies

Türkiye . 389 parts In-Stock

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Corohmni

South Africa . 340 parts In-Stock

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Overview

Unleash the power of efficient energy management with the MC34161DMR2 by Onsemi. This innovative Power Management IC boasts top-notch quality and reliability, crafted by a renowned manufacturer in the industry. Ideal for a variety of applications, this product offers unparalleled value to customers seeking optimized performance and enhanced functionality. Experience the benefits of superior power supply support in a compact, user-friendly package that guarantees seamless integration and maximum efficiency. Elevate your projects with the MC34161DMR2 and unlock a world of possibilities in power management technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic packaging provides durability and reliability to the product, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy installation on PCBs, saving space and providing a more compact design.

Nominal Supply Voltage (Vsup): 5 V

Compatible with common voltage levels used in electronic devices, making it versatile for a wide range of applications.

No. of Terminals: 8

Sufficient number of terminals for connectivity options and flexibility in circuit design.

Maximum Operating Temperature: 70 °C

High operating temperature range ensures stability and performance under various environmental conditions.

Minimum Operating Temperature: 0 °C

Wide range of operating temperatures allows for use in different climates and settings.

Technology: BIPOLAR

Bipolar technology offers high efficiency and precise control over power management functions.

Maximum Supply Voltage (Vsup): 40 V

High maximum supply voltage capability makes it suitable for applications requiring higher power levels.

Technical Specifications

Power Management ICs MC34161DMR2 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

MINIMUM SUPPLY NEEDED FOR NEGATIVE SENSING IS 4V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.9 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

MC34161DMR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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