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MC33262CDR2G

Onsemi

MC33262CDR2G by Onsemi

MC33262CDR2G by Onsemi is a switching regulator with 12V nominal voltage, 0.5A max output current, and PWM control mode. Ideal for boost applications in industrial settings due to its compact size, dual terminals, and wide operating temperature range from -40 °C to 105°C.

Median Price

$0.515

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 368 parts In-Stock

1+ parts

-

100+ parts

$0.515

1k+ parts

$0.428

10k+ parts

$0.381

368

-

$0.515

$0.428

$0.381

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 454 parts In-Stock

1+ parts

$0.401

100+ parts

-

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454

$0.401

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Vyrian

USA . 4,867 parts In-Stock

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4,867

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Distributors (Availability)

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Corphita

USA . 1,350 parts In-Stock

1+ parts

$0.380

100+ parts

-

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1,350

$0.380

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Corohmni

South Africa . 69 parts In-Stock

1+ parts

$0.422

100+ parts

-

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69

$0.422

-

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Component Stockers USA

USA . 328 parts In-Stock

1+ parts

$0.440

100+ parts

$0.410

1k+ parts

-

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328

$0.440

$0.410

-

-

AZTECH Wire

Italy . 193 parts In-Stock

1+ parts

$12.250

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193

$12.250

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QUARKTWIN TECHNOLOGY LTD

USA . 10,560 parts In-Stock

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10,560

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Kepictronics

USA . 10,000 parts In-Stock

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10,000

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TANS Electronics

Latvia . 5,786 parts In-Stock

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5,786

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Kulean Microsystems

USA . 5,207 parts In-Stock

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5,207

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Microchip USA

USA . 4,845 parts In-Stock

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4,845

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SupplyDigital Components

Austria . 1,033 parts In-Stock

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1,033

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Problanco Electronics

Mexico . 682 parts In-Stock

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682

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Perfect Parts

USA . 445 parts In-Stock

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445

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UHIMA Technologies

Türkiye . 349 parts In-Stock

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349

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Overview

Enhance your electronic devices with the MC33262CDR2G by Onsemi, a high-quality switching regulator that guarantees reliable performance. Manufactured by industry leader Onsemi, this product offers superior control mode and efficient power supplies for a wide range of applications. With its compact package style and advanced technology, this regulator ensures optimal power management while maintaining a low operating temperature. Upgrade your systems with the MC33262CDR2G and experience the value of enhanced efficiency and performance in your devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and durability, making the product suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing production costs.

Nominal Supply Voltage (Vsup): 12 V

Operating at a nominal voltage of 12V ensures compatibility with common power sources and devices.

Control Mode: CURRENT-MODE

Current-mode control provides faster transient responses and better current limiting, enhancing the stability and performance of the regulator.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105 °C, the regulator can withstand elevated temperatures, ensuring reliability in demanding applications.

Technology: BIPOLAR

Bipolar technology offers high-speed switching and precise control, making the regulator efficient and responsive.

Nominal Output Voltage: 16 V

Providing a stable output voltage of 16V, the regulator can power a wide range of electronic devices consistently.

Technical Specifications

Switching Regulators & Controllers MC33262CDR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

28 V

Minimum Input Voltage:

9 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.5 A

Nominal Output Voltage:

16 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Maximum Supply Current (Isup):

20 mA

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Switcher Config:

BOOST

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

MC33262CDR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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