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MC26LS30DR2G

Onsemi

MC26LS30DR2G by Onsemi

MC26LS30DR2G by Onsemi is a 4-function line driver with 16 terminals, operating at ±5V. It has a max transmit delay of 300ns and supports EIA-422-A & EIA-423-A standards. Ideal for industrial applications requiring high-speed data transmission in harsh environments.

Median Price

$3.850

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 9 parts In-Stock

1+ parts

$3.850

100+ parts

$2.880

1k+ parts

$2.500

10k+ parts

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9

$3.850

$2.880

$2.500

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Vyrian

USA . 5,934 parts In-Stock

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Digiode

USA . 1,819 parts In-Stock

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1,819

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Cyclops Electronics Ltd

UK . 132 parts In-Stock

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132

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Semi Source

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 485 parts In-Stock

1+ parts

$3.850

100+ parts

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485

$3.850

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AZTECH Wire

Italy . 352 parts In-Stock

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$19.480

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352

$19.480

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QUARKTWIN TECHNOLOGY LTD

USA . 15,867 parts In-Stock

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15,867

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Problanco Electronics

Mexico . 7,327 parts In-Stock

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7,327

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A-Z Elektronik GmbH

Germany . 4,563 parts In-Stock

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4,563

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Kulean Microsystems

USA . 4,388 parts In-Stock

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4,388

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Microchip USA

USA . 4,219 parts In-Stock

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4,219

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TANS Electronics

Latvia . 646 parts In-Stock

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646

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Corphita

USA . 555 parts In-Stock

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555

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SupplyDigital Components

Austria . 377 parts In-Stock

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377

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Metaverse IC Inc.

Canada . 266 parts In-Stock

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266

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UHIMA Technologies

Türkiye . 251 parts In-Stock

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251

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Perfect Parts

USA . 159 parts In-Stock

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159

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Overview

Elevate your electronic designs with the MC26LS30DR2G by Onsemi, a top-tier manufacturer known for its quality and reliability. As part of the Line Drivers & Receivers category, this product offers unparalleled performance and versatility in various applications. With its advanced technology, industrial-grade temperature range, and 3-STATE output characteristics, the MC26LS30DR2G delivers exceptional value and benefits to customers looking for seamless communication solutions. Experience the difference with Onsemi's innovative interface IC type and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Easy to install and saves space on the PCB, making it suitable for compact electronic devices.

Maximum Supply Voltage: 5.25 V

Can handle higher voltage inputs, providing flexibility in different circuit designs.

No. of Functions: 4

Versatile product with multiple functions available in a single package, saving on board space and cost.

Maximum Transmit Delay: 300 ns

Fast signal transmission speed ensures efficient data transfer in real-time applications.

Power Supplies (V): +-5

Supports both positive and negative power supplies, allowing for versatile power configurations.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where heat dissipation is important.

Technology: BIPOLAR

Bipolar technology offers good noise immunity and high speed, making it reliable for data transmission.

Interface Standard: EIA-422-A; EIA-423-A

Compliant with industry standards for reliable and compatible communication with other devices.

Nominal Supply Voltage: 5 V

Standard voltage level for easy integration with common microcontrollers and logic circuits.

Technical Specifications

Line Drivers & Receivers MC26LS30DR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

FOUR SINGLE ENDED DRIVERS OR TWO DIFFERENTIAL DRIVERS

Differential Output:

NO

Driver No. of Bits:

4

Maximum High Level Input Current:

.00004 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-422-A; EIA-423-A

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

300 ns

Width:

3.9 mm

Trade Compliance

MC26LS30DR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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