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MC26LS30DG

Onsemi

MC26LS30DG by Onsemi

MC26LS30DG by Onsemi is a 4-function line driver with 16 terminals. It operates at temperatures from -40 to 85 °C and has a max supply voltage of 5.25 V. Ideal for EIA-422-A and EIA-423-A interfaces, it features a small outline package style for industrial applications.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Vyrian

USA . 2,130 parts In-Stock

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Digiode

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Global Solutions Electronics Company

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Sea View Technologies

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Bristol Electronics

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R&J Components

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Component Stockers USA

USA . 409 parts In-Stock

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Problanco Electronics

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SupplyDigital Components

Austria . 6,330 parts In-Stock

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Kulean Microsystems

USA . 5,048 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 3,331 parts In-Stock

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Corphita

USA . 1,762 parts In-Stock

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UHIMA Technologies

Türkiye . 429 parts In-Stock

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Corohmni

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Overview

Enhance your electronic designs with the MC26LS30DG by Onsemi, a top-quality line driver & receiver that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted leader in the industry, this product delivers exceptional value and benefits to customers in various applications. With its advanced technology and industrial-grade temperature grade, the MC26LS30DG ensures efficient data transmission, low power consumption, and seamless integration. Elevate your projects with the MC26LS30DG and experience superior results like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and high performance, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount design allows for easy installation and saves space on the circuit board.

Maximum Supply Voltage: 5.25 V

Can handle high voltage levels, making it suitable for a wide range of industrial applications.

No. of Functions: 4

Having multiple functions in one product provides versatility and saves on board space and components.

Package Shape: RECTANGULAR

Rectangular shape is standardized and fits well on most circuit boards, ensuring easy integration.

Maximum Transmit Delay: 300 ns

Low transmit delay ensures fast data transmission, making it ideal for real-time applications.

Power Supplies (V): +-5

Supports dual power supplies, allowing for flexibility in voltage requirements.

No. of Terminals: 16

Having multiple terminals enables connectivity to various components, increasing functionality.

Package Style: SMALL OUTLINE

Compact size saves space on the board, suitable for applications where size constraints are a concern.

Maximum High Level Input Current: 0.00004 Amp

Low input current reduces power consumption and heat dissipation, improving overall efficiency.

Technical Specifications

Line Drivers & Receivers MC26LS30DG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

FOUR SINGLE ENDED DRIVERS OR TWO DIFFERENTIAL DRIVERS

Differential Output:

NO

Driver No. of Bits:

4

Maximum High Level Input Current:

.00004 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-422-A; EIA-423-A

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

300 ns

Width:

3.9 mm

Trade Compliance

MC26LS30DG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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