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MC26LS30DR2

Onsemi

MC26LS30DR2 by Onsemi

MC26LS30DR2 by Onsemi is a Line Driver & Receiver with 4 functions, operating at 5V. It has a max transmit delay of 300ns and supports EIA-422-A; EIA-423-A interface standards. Ideal for industrial applications requiring high-speed data transmission in harsh environments.

Median Price

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Lifecycle Status

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Digiode

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Vyrian

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EMSNET

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ComSIT Distribution GmbH

Germany . 118 parts In-Stock

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Pegasus Components GmbH

Germany . 47 parts In-Stock

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J2 Sourcing AB

Sweden . 10 parts In-Stock

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Velocity Electronics

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ACDS - Activité Composants Distribution Service

France . 5 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,550 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,980 parts In-Stock

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TANS Electronics

Latvia . 6,196 parts In-Stock

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Problanco Electronics

Mexico . 6,196 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

Austria . 1,368 parts In-Stock

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Assy Fe

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Metaverse IC Inc.

Canada . 522 parts In-Stock

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Corphita

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Microchip USA

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UHIMA Technologies

Türkiye . 142 parts In-Stock

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Corohmni

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Overview

Enhance your communication systems with the MC26LS30DR2 Line Driver & Receiver by Onsemi. Known for their top-notch quality and reliability, Onsemi delivers cutting-edge technology that ensures seamless data transmission. This versatile product is ideal for a wide range of applications, from industrial automation to telecommunications. With fast transmit delay, low power consumption, and high-level input current, the MC26LS30DR2 provides exceptional value and performance. Upgrade your systems today and experience the benefits of superior connectivity with Onsemi's innovative line driver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable, the product is easy to install and saves space on the PCB, making it ideal for compact designs.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, the product can handle a wide range of power inputs and is compatible with various systems.

No. of Functions: 4

Having multiple functions in one package reduces the need for additional components, simplifying the design and reducing overall costs.

Maximum Transmit Delay: 300 ns

The low transmit delay ensures fast and efficient signal transmission, making the product suitable for high-speed applications.

Power Supplies (V): 5,+-15

The wide range of power supply options allows flexibility in system design and compatibility with different power sources.

No. of Terminals: 16

Having 16 terminals provides ample connection points for interfacing with other components, making the product versatile in use.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions, making the product suitable for industrial applications.

Output Characteristics: 3-STATE

The 3-STATE output allows the product to be easily enabled or disabled, providing greater flexibility in controlling the output signals.

Technology: BIPOLAR

The bipolar technology offers high-speed operation and precise signal control, making the product suitable for demanding applications.

Technical Specifications

Line Drivers & Receivers MC26LS30DR2 attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

FOUR SINGLE ENDED DRIVERS OR TWO DIFFERENTIAL DRIVERS

Differential Output:

NO

Driver No. of Bits:

4

Maximum High Level Input Current:

.00004 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-422-A; EIA-423-A

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5,+-15

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

300 ns

Width:

3.9 mm

Trade Compliance

MC26LS30DR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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