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MC26LS30D

Onsemi

MC26LS30D by Onsemi

MC26LS30D by Onsemi is a Line Driver & Receiver with 4 functions, operating at -40 to 85 °C. It has a max transmit delay of 300 ns and supports EIA-422-A; EIA-423-A interface standards. Ideal for industrial applications requiring bipolar technology and standard input characteristics.

Median Price

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Lifecycle Status

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J2 Sourcing AB

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Semi Source

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SupplyDigital Components

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Overview

Elevate your communication systems with the MC26LS30D by Onsemi, a top-tier line driver & receiver that guarantees seamless data transmission. Crafted with precision by Onsemi, this product promises unparalleled quality and reliability. Ideal for industrial applications, this device offers superior performance and efficiency, ensuring a smooth operation every time. Stay ahead of the game with the MC26LS30D by Onsemi and experience the value it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside the package, ensuring reliable performance over time.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and making the product suitable for compact designs.

Maximum Supply Voltage: 5.25 V

Can handle higher voltage inputs, providing flexibility in various applications.

No. of Functions: 4

Offers multiple functions in a single device, reducing the need for additional components and simplifying the circuit design.

Maximum Transmit Delay: 300 ns

Provides fast signal transmission, ensuring efficient communication in high-speed applications.

Power Supplies (V): 5,+-15

Supports different power supply voltages, making it versatile and compatible with various systems.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments, suitable for industrial settings.

Output Characteristics: 3-STATE

Allows the output to be in a high-impedance state, enhancing compatibility with multiple devices on the bus.

Technology: BIPOLAR

Offers good noise immunity and robust performance, suitable for demanding applications.

Interface Standard: EIA-422-A; EIA-423-A

Complies with industry standards, ensuring compatibility and interoperability with other equipment.

Technical Specifications

Line Drivers & Receivers MC26LS30D attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

FOUR SINGLE ENDED DRIVERS OR TWO DIFFERENTIAL DRIVERS

Differential Output:

NO

Driver No. of Bits:

4

Maximum High Level Input Current:

.00004 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-422-A; EIA-423-A

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5,+-15

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

300 ns

Width:

3.9 mm

Trade Compliance

MC26LS30D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-562-9355, 5962015629355

NIIN

015629355

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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